产品概述
描述
The ST4SIM-111M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all industrial devices.
The ST4SIM-111M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.
The device ensures the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).
The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).
The device provides a secure and interoperable Java® Card environment compliant with Java® Card v3.0.5 ClassicMoreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.
The device integrates a dynamic memory management with Java® Card garbage collection mechanism optimizing the usage of the memory.
The device is based on the ST33G1M2M, an industrial grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core.
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所有功能
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- Cellular network connectivity configuration provided by trusted partners
- Compliant with 3G / 4G (LTE) / 5G / NB-IoT / CAT–M networks
- Network access applications supported: SIM / USIM / ISIM / CSIM
- Secure element access control (ARF / PKCS#15)
- OTA capability over SMS, CAT-TP & HTTPS (including DNS)
- Multi-interfaces able to combine (U)SIM + eSE
- Hardware
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- Product available on ST33G1M2M
- ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
- Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
- Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
- Serial peripheral interface (SPI), depending on packages
- Industrial qualification (JEDEC JESD47)
- Operating temperature: -40°C to +105°C
- Common Criteria EAL5+
- ECOPACK-compliant packages
- 2FF, 3FF or 4FF plugin card
- DFN8 with wettable flanks (MFF2)
- WLCSP11
- 安保
- Symmetric cryptography DES / 3DES / AES
- Asymmetric cryptography RSA (up to 2048 bits)
- HTTPS remote management TLS v1.0, v1.1 and v1.2
- Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
- Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE
- Software standard compliancy
- Java® Cardv.3.0.5 Classic
- GlobalPlatform®card specification v2.3, including GP amendments A, B, C, D and E
- ETSI, 3GPP and 3GPP release 16 (for further information, contact the local STMicroelectronics sales office)
- Power saving features (PSM and eDRX) defined by ETSI
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EDA符号、封装和3D模型
STMicroelectronics - ST4SIM-111M
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| ST4SI1M0008SCIFW | 批量生产 | VFDFPN 8 5X6 WETTABLE FLANK | 工业 | N/A | |
| ST4SIM-111M | 批量生产 | DICE | 工业 | N/A | |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（ºC） | Service and Connectivity Provider | Operating Temperature (°C) (min) | Service and Connectivity Provider | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||||
| ST4SI1M0008SCIFW | | | distributors 无法联系到经销商，请联系我们的销售办事处 | VFDFPN 8 5X6 WETTABLE FLANK | Tape and Reel | PHILIPPINES | 3A991.a.2 | NEC | -40 | 105 | Soracom | -40 | Soracom | |||
| ST4SIM-111M | | | distributors 无法联系到经销商，请联系我们的销售办事处 | DICE | Not Applicable | FRANCE | 3A991.a.2 | NEC | -40 | 105 | - | -40 | - | |||
ST4SI1M0008SCIFW 批量生产
ST4SIM-111M 批量生产