ST4SIM-200A

批量生产

GSMA eSIM system-on-chip for secure automotive applications

下载数据摘要
概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
Partner products
Sales Briefcase

产品概述

描述

The ST4SIM-200A is an STMicroelectronics top-class embedded SIM (eSIM or eUICC) product designed for the automotive ecosystem. This solution is based on the ST33G1M2A0, an automotive grade hardware solution, AEC-Q100 qualified grade 2.
The ST4SIM-200A is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2. It can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on). The ST4SIM-200A can include an embedded secure element to store credential and/or independent applications directly managed by the MCU (or by another OEM element). The ST4SIM-200A provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200A integrates the most advanced UICC features compliant with GlobalPlatform, ETSI, 3GPP, 3GPP2 specifications. The ST4SIM-200A integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory. The ST4SIM-200A is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm SecurCore SC300 RISC core.
  • 所有功能

      • AEC-Q100 qualified Grade 2
      • Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications
      • Bootstrap connectivity profile
      • Up to 7 profiles (depending on memory size)
      • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
      • Network access applications supported: SIM / USIM / ISIM / CSIM
      • Secure element access control (ARF / PKCS#15)
      • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
      • Multi-interfaces able to combine eSIM + eSE
    • Hardware
      • Product available on ST33G1M2A0
      • ST33 product based on a 32-bit Arm SecurCore SC300 RISC core
      • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
      • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
      • Serial Peripheral Interface (SPI), depending on packages
      • Automotive qualification (AEC-Q100 Grade 2)
      • Operating temperature: -40°C to +105°C
      • Common Criteria EAL5+
    • ECOPACK-compliant packages
      • DFN8 Wettable Flank (MFF2)
      • TSSOP20
    • 安保
      • Symmetric cryptography DES / 3DES / AES
      • Asymmetric cryptography RSA (up to 2048 bits)
      • HTTPS remote management TLS v1.0, v1.1 and v1.2
      • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
      • Authentication algorithm: MILENAGE, TUAK, CAVE
    • Software standard compliancy
      • GSMA SGP.02 v3.2
      • SIMalliance interoperable profile v2.1
      • Java Card™ v3.0.4 Classic
      • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
      • ETSI, 3GPP and 3GPP2 release 12 (for further information, contact your local STMicroelectronics sales office)
      • Power saving features (PSM and eDRX) defined by ETSI release 13
    • Certification
      • GlobalPlatform-certified "Muse eUICC-i2 v1" compliant with GSMA SGP.02 v3.2

您可能还会喜欢...

Watch our webinar on how eSIM is forging
a new future in IoT for the 2020s
Discover ST4SIM: ST's SIM & eSIM portfolio
for cellular connectivity solutions

All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      Global IoT Cellular Connectivity

      批量生产

      IoT Connectivity for ST4SIM - 2G, 3G, 4G and LPWAN

      Embedded Software from Partners Truphone
      Global IoT Cellular Connectivity

      描述:

      IoT Connectivity for ST4SIM - 2G, 3G, 4G and LPWAN

      eSIM/eUICC global roaming profile

      批量生产

      enables out-of-the-box global cellular connectivity embedded in ST4SIM

      Embedded Software from Partners Arkessa
      eSIM/eUICC global roaming profile

      描述:

      enables out-of-the-box global cellular connectivity embedded in ST4SIM
    • 产品型号
      状态
      描述
      类型
      供应商

      Global Enterprise Connect

      批量生产

      Connectivity & eSIM Subscription Management Services for Enterprises

      合作伙伴提供的全球服务 Arkessa
      Global Enterprise Connect

      描述:

      Connectivity & eSIM Subscription Management Services for Enterprises

      Truphone SM-DP SM-SR

      批量生产

      Truphone云订阅管理器数据准备平台(SM-DP)和安全路由平台(SM-SR)。

      合作伙伴提供的全球服务 Truphone
      Truphone SM-DP SM-SR

      描述:

      Truphone云订阅管理器数据准备平台(SM-DP)和安全路由平台(SM-SR)。

EDA符号、封装和3D模型

STMicroelectronics - ST4SIM-200A

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST4SIM-200A
批量生产
DICE 工业 N/A

ST4SIM-200A

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
Service and Connectivity Provider
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Budgetary Price (US$)*/Qty
更多信息
最小值
最大值
ST4SIM-200A 无法联系到经销商,请联系我们的销售办事处
批量生产
- 3A991A2 NEC Not Applicable DICE -40 105
更多信息

单价(US$):

-

Country of Origin:

FRANCE

ST4SIM-200A

供货状态

批量生产

Service and Connectivity Provider

-

Budgetary Price (US$)*/Qty

ECCN (US)

3A991A2

ECCN (EU)

NEC

包装类型

Not Applicable

封装

DICE

Operating Temperature (°C)

(最小值)

-40

(最大值)

105

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商