产品概述
描述
The STPay-BlueAmb-22 is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications. With up to 55 Kbytes of user nonvolatile memory, the STPay-BlueAmb-22 can be configured to support MasterCard® M/Chip® Advance and JCB® payment applications. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.
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所有功能
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- Java Card™ platform
- Up to 55 Kbytes of user nonvolatile memory
- Certified payment applications: MasterCard® and JCB®
- Common Personalization Specification (CPS) personalization
- Platform
- Java Card™ 3.0.4 classic operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 or T = 1 contact interface
- Hardware
- 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
- Up to 55 Kbytes of user NVM
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- Enhanced personalization performance for very fast personalization
- EMV® CPS v1.1 compliant
- M/Chip® Advance v1.2.2 Common Personalization Specification
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All tools & software
All resources
| Resource title | Latest update |
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产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 21 Feb 2019 | 21 Feb 2019 |
简报 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 14 Aug 2020 | 14 Aug 2020 | |||
| 14 Apr 2021 | 14 Apr 2021 |
宣传册 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 26 Nov 2020 | 26 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 | |||
| 23 Nov 2020 | 23 Nov 2020 |
手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Mar 2021 | 19 Mar 2021 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STPay-BlueAmb-22
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STPAY-BLUEAMB-22 | 批量生产 | DICE | 工业 | N/A | |
STPAY-BLUEAMB-22
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| STPAY-BLUEAMB-22 | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 3A991A2 | NEC | Not Applicable | DICE | - | - | FRANCE | |||
供货状态
批量生产ECCN (US)
3A991A2