Dual DDA Boosted product (ST31G + STPay-Tiger +STS3922) Secure SIP product for optimized wearable

下载产品简介
概述
工具与软件
资源
解决方案
质量与可靠性
Sales Briefcase
eDesignSuite
开始
样片和购买
Partner products
  • The STPay-Boost is a system-in-package payment solution optimized for wearable devices such as wrist bands and smart watches. It offers wearable manufacturers a ready-to-use contactless payment application compatible with very small antenna sizes.

    The STPay-Boost consists of an STPay-Tiger secure payment solution based on an Arm® SecurCore® RISC core, and an analog front-end with active load modulation in a single package.
    It is delivered in a WFBGA64 package dimensioned for use in small-footprint devices.
    The STPay-Boost contains a GlobalPlatform 2.2.1 Java Card 3.0.4 platform for payment applications with up to 135 Kbytes of nonvolatile memory for user applets and personalization data. It can be configured to support Visa VSDC, MasterCard M/Chip Advance, JCB and Interac Flash payment applications.
    For detailed configuration data, contact your local ST sales office.

    Key Features

      • Java Card™ platform
      • Enhanced active load modulation technology
      • Compatible with extremely small or metal frame antennas
      • Up to 135 Kbytes of user nonvolatile memory
      • Certified payment applications: Visa®, MasterCard®, JCB® and Interac®
      • Common Personalization Specification (CPS) personalization
    • Platform
      • Java Card™ 3.0.4 classic operating system
      • GlobalPlatform® 2.2.1 MG 1.0.1 API support
      • CPS-compliant
      • ISO/IEC 14443 Type A contactless interface
    • Hardware
      • 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller and STS3922 analog front-end with active load modulation
      • Battery-assisted operation
      • Up to 135 Kbytes of user NVM
      • System-in-package: ECOPACK®2-compliant 64-ball very, very thin profile, fine pitch, ball grid array package (WFBGA64)
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • Enhanced personalization performance for very fast personalization
      • EMV® CPS v1.1 compliant
      • VSDC (Visa smart debit/credit) Personalization Specification v 2.0
      • M/Chip® Advance v1.2.1 Common Personalization Specification

样片和购买

产品型号
供货状态
封装
ECCN (EU)
Country of Origin
从分销商订购
从ST订购
STPAY-BOOST
批量生产
DICE NEC - 没有经销商,请联系我们的销售办事处

STPAY-BOOST

供货状态

批量生产

封装

DICE

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

相关应用

可穿戴设备

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DB3443
      ST Payment Secure Solution – Java Card™ platform with active load modulation for EMV® payment applications
      2.0
      556.89 KB
      PDF
      DB3443

      ST Payment Secure Solution – Java Card™ platform with active load modulation for EMV® payment applications

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      STPay Ease & Secure your Payment 1.0
      514.88 KB
      PDF

      STPay Ease & Secure your Payment

    • 描述 版本 文档大小 操作
      Brochure Secure MCUs - Secure Solutions 1.0
      1.48 MB
      PDF

      Brochure Secure MCUs - Secure Solutions

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
STPAY-BOOST
批量生产
DICE 工业 N/A

STPAY-BOOST

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.