产品概述

描述

The STPay-CPA is a GlobalPlatform^® 2.2.1 Java Card™ platform for payment applications. With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm^® SecurCore^® RISC core.
The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.

所有功能
Java Card™ platform

Up to 115 Kbytes of user nonvolatile memory

Certified payment application: EMVCo^® Common Payment Application (CPA)

Common Personalization Specification (CPS) personalization

Platform

Java Card™ 2.2.2 operating system

GlobalPlatform^® 2.2.1 MG 1.0.1 API support

CPS-compliant

ISO/IEC 7816 T = 0 contact interface

Hardware

32-bit Arm^® SecurCore^® SC000™ ST31 secure microcontroller

Up to 115 Kbytes of user NVM

Cryptography

NESCRYPT cryptographic RSA coprocessor

Enhanced DES accelerator (EDES)

Personalization

EMV^® CPS v1.1 compliant
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All tools & software

MCU 及 MPU嵌入式软件

产品型号	状态	描述	类型	供应商
STACKFORCE mioty® Protocol Stack for end points	批量生产	mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.	STM32第三方嵌入式软件	STACKFORCE	STACKFORCE mioty® Protocol Stack for end points 描述: mioty Protocol Stack for end nodes, implementing the new ETSI standard TS 103357.

All resources

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	Resource title		Latest update

产品规格 (1)

	Resource title		Latest update
PDF	DB3877 ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications 1.0		12 Mar 2019	12 Mar 2019 DB3877 ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications 1.0

简报 (2)

	Resource title		Latest update
PDF	Banking & ID secure solutions 1.1		14 Aug 2020	14 Aug 2020 Banking & ID secure solutions 1.1
PDF	Biometric SoC secure solutions 1.0		14 Apr 2021	14 Apr 2021 Biometric SoC secure solutions 1.0

宣传册 (3)

	Resource title	Latest update
PDF	Biometric System-on-Card: A step ahead in security and privacy 1.0	26 Nov 2020	26 Nov 2020 Biometric System-on-Card: A step ahead in security and privacy 1.0
PDF	STPay to ease & secure your payment 1.1	23 Nov 2020	23 Nov 2020 STPay to ease & secure your payment 1.1
PDF	eGovernment & eID flexible and secure solutions 2.0	23 Nov 2020	23 Nov 2020 eGovernment & eID flexible and secure solutions 2.0

手册 (1)

	Resource title		Latest update
PDF	Secure solutions portfolio 1.0		19 Mar 2021	19 Mar 2021 Secure solutions portfolio 1.0

EDA Symbols, Footprints and 3D Models

质量与可靠性

产品型号	Marketing Status	封装	等级规格	符合RoHS级别	材料声明**
STPAY-CPA	批量生产	DICE	工业	N/A

STPAY-CPA

Package:

DICE

Material Declaration**:

More Info

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
	STPAY-CPA	无法联系到经销商，请联系我们的销售办事处		批量生产	3A991A2	NEC	Not Applicable	DICE	-	-	FRANCE