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  • The STPay-CPA is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications.

    With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.
    The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.

    Key Features

      • Java Card™ platform
      • Up to 115 Kbytes of user nonvolatile memory
      • Certified payment application: EMVCo® Common Payment Application (CPA)
      • Common Personalization Specification (CPS) personalization
    • Platform
      • Java Card™ 2.2.2 operating system
      • GlobalPlatform® 2.2.1 MG 1.0.1 API support
      • CPS-compliant
      • ISO/IEC 7816 T = 0 contact interface
    • Hardware
      • 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
      • Up to 115 Kbytes of user NVM
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • EMV® CPS v1.1 compliant

样片和购买

产品型号
供货状态
封装
ECCN (EU)
Country of Origin
从分销商订购
从ST订购
STPAY-CPA
批量生产
DICE NEC - 没有经销商,请联系我们的销售办事处

STPAY-CPA

供货状态

批量生产

封装

DICE

ECCN (EU)

NEC

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DB3877
      ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications
      1.0
      1.99 MB
      PDF
      DB3877

      ST Payment Secure Solution – Java Card™ platform with up to 115 Kbytes of user NVM for CPA SDA and DDA applications

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      STPay Ease & Secure your Payment 1.0
      514.88 KB
      PDF

      STPay Ease & Secure your Payment

    • 描述 版本 文档大小 操作
      Brochure Secure MCUs - Secure Solutions 1.0
      1.48 MB
      PDF

      Brochure Secure MCUs - Secure Solutions

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
STPAY-CPA
批量生产
DICE 工业 N/A

STPAY-CPA

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.