产品概述
描述
The STPay-CPA is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications. With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.
-
所有功能
-
- Java Card™ platform
- Up to 115 Kbytes of user nonvolatile memory
- Certified payment application: EMVCo® Common Payment Application (CPA)
- Common Personalization Specification (CPS) personalization
- Platform
- Java Card™ 2.2.2 operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 contact interface
- Hardware
- 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
- Up to 115 Kbytes of user NVM
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- EMV® CPS v1.1 compliant
-
All tools & software
All resources
Resource title | Latest update |
---|
产品规格 (1)
Resource title | Latest update | |||
---|---|---|---|---|
12 Mar 2019 | 12 Mar 2019 |
简报 (2)
Resource title | Latest update | |||
---|---|---|---|---|
14 Aug 2020 | 14 Aug 2020 | |||
14 Apr 2021 | 14 Apr 2021 |
宣传册 (3)
Resource title | Latest update | |||
---|---|---|---|---|
26 Nov 2020 | 26 Nov 2020 | |||
23 Nov 2020 | 23 Nov 2020 | |||
23 Nov 2020 | 23 Nov 2020 |
手册 (1)
Resource title | Latest update | |||
---|---|---|---|---|
19 Mar 2021 | 19 Mar 2021 |
EDA Symbols, Footprints and 3D Models
质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
---|---|---|---|---|---|
STPAY-CPA | 批量生产 | DICE | 工业 | N/A | |
STPAY-CPA
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持 。