产品概述
描述
The STPay-CPA is a GlobalPlatform® 2.2.1 Java Card™ platform for payment applications.
With up to 115 Kbytes of user nonvolatile memory, the STPay-CPA is configured to support EMVCo Common Payment Application (CPA) payment applications both in Static data authentication (SDA) and Dynamic/Combined data authentication (DDA/CDA) configurations. It integrates a secure microcontroller that is based on an Arm® SecurCore® RISC core.
The STPay System-on-Chip (SoC) family is a packaged offering by ST, comprising a highly secure microcontroller, embedded application software, tools and support aimed at serving the needs of card embedders and personalization bureaus worldwide.
-
所有功能
-
- Java Card™ platform
- Up to 115 Kbytes of user nonvolatile memory
- Certified payment application: EMVCo® Common Payment Application (CPA)
- Common Personalization Specification (CPS) personalization
- Platform
- Java Card™ 2.2.2 operating system
- GlobalPlatform® 2.2.1 MG 1.0.1 API support
- CPS-compliant
- ISO/IEC 7816 T = 0 contact interface
- Hardware
- 32-bit Arm® SecurCore® SC000™ ST31 secure microcontroller
- Up to 115 Kbytes of user NVM
- Cryptography
- NESCRYPT cryptographic RSA coprocessor
- Enhanced DES accelerator (EDES)
- Personalization
- EMV® CPS v1.1 compliant
-
精选 视频
特别推荐
EDA符号、封装和3D模型
STMicroelectronics - STPay-CPA
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STPAY-CPA | 批量生产 | DICE | 工业 | N/A | |
STPAY-CPA
Package:
DICEMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| STPAY-CPA | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 3A991.a.2 | NEC | Not Applicable | DICE | - | - | FRANCE | | ||
Buy Direct at ST