STPay-Topaz-1

批量生产

Dual-interface DDA JavaCard platform with up to 60 kbytes of user NVM

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样片和购买
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质量与可靠性
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产品概述

描述

The STPay-Topaz-1 is a GlobalPlatform 2.2.1 Java Card platform for payment and loyalty applications, based on the 40 nm Flash technology and up to 60 Kbytes of user non-volatile memory. The STPay-Topaz-1 can be configured to support VISA VSDC 2.9.1 or 2.8.1g1, MasterCard M/Chip Advance 1.2.3, Interac Flash 1.6, Discover 1.1, AMEX AEIPS 4.4, JCB D.1.1, qSPARC 2.0, Elo 1.5.3.g and MIR 1.1.4.0 EMV payment applications. It also supports the L-applet for loyalty, membership and frequent traveler applications.
The STPay-Topaz-1 is also available as a Java virtual machine (JVM) platform, providing 200 Kbytes of non-volatile memory for customer applets.
The STPay system-on-chip solution is a family of products that come ready for embedding in smartcards and loaded with payment applications that run on certified Java Card platforms. They meet all required security and payment-scheme certifications.
For detailed configuration data, contact your local ST sales office.
  • 所有功能

      • 40 nm Flash technology
      • Java Card™ platform
      • Up to 60 Kbytes of user NVM
      • Certified payment applications: VISA, MasterCard, Interac Flash, Discover, AMEX, JCB, RuPay, Elo and MIR
      • Common Personalization Specification (CPS) personalization
    • Platform
      • Java Card 3.0.5 classic operating system
      • GlobalPlatform® 2.2.1 MG 1.0.1 API support
      • CPS-compliant
      • ISO/IEC 7816 T = 0 or T = 1 contact protocol
      • ISO/IEC 14443 Type A contactless interface
    • Hardware
      • ST31 product based on a 32-bit Arm® SecurCore® SC000™ RISC core
      • Advanced 40 nm Flash technology
      • Best-in-class RF performance
      • Up to 60 Kbytes of user non-volatile memory
    • Cryptography
      • NESCRYPT cryptographic RSA coprocessor
      • Enhanced DES accelerator (EDES)
    • Personalization
      • Enhanced personalization performance for very fast personalization
      • EMV® CPS v1.1 compliant
      • VISA smart debit/credit (VSDC) Personalization Specification v2.0
      • M/Chip Advance 1.2.3 Common Personalization Specification

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EDA符号、封装和3D模型

STMicroelectronics - STPay-Topaz-1

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质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STPAY-TOPAZ-1
批量生产
DICE 工业 N/A

STPAY-TOPAZ-1

Package:

DICE

Material Declaration**:

Marketing Status

批量生产

Package

DICE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STPAY-TOPAZ-1 无法联系到经销商,请联系我们的销售办事处
批量生产
3A991A2 NEC Not Applicable DICE - - FRANCE

STPAY-TOPAZ-1

供货状态

批量生产

ECCN (US)

3A991A2

ECCN (EU)

NEC

包装类型

Not Applicable

封装

DICE

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商