产品概述
描述
The STSAFE-V500 system on chip is a top-class embedded secure element (eSE) able to manage Java® Card applets from different stakeholders (such as the user, original equipment manufacturer (OEM), hardware integrator, or service provider).
The STSAFE-V500 is providing a full range of solutions according to different use cases detailed in this document such as:
Each solution is identified as a standalone turn key solution (no dynamic switch possible between the different solutions).
It also proposes an open Java® Card pen platform capable of loading any third-party Java® Card applet.
Both a turn key solution and an Open Java® Card platform solution offer a common backbone to ease final user integration; this document describes the common set of features (the common backbone) and highlights also specific features relevant for each turn key solution.
The device is compliant with Java® Card 3.0.5 with enhanced mechanisms of memory management, security, and data management.
It also supports the GlobalPlatform® Card Specifications v.2.3 and related amendments:
The STSAFE-V500 is integrated with Android™ applications Keymint and Weaver. It can also host STMicroelectronics applications for secure storage.
It supports multiple logical secure elements that allow multiple Android™ Linux® virtual machines executing on a hypervisor environment accessing Java® Card applications.
It provides state-of-the-art security for the provided functionality, resistant to recent EMVCo/JIL hardware-related attacks subgroup (JHAS) identified vulnerabilities; it ensures a high level of security and isolation between applications, and Common Criteria EAL5+ certification is ongoing (specific for SB).
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所有功能
- Hardware features
- AEC-Q100 grade 2
- Arm® Cortex®-M35P 32-bit RISC core cadenced at 63 MHz
- Operating temperature range: −40 °C to 105 °C
- High-stress memory:
- Endurance of 500 000 erase/write cycles (without hardware wear leveling)
- Configured to enhance specific objects endurance: up to 10 million write cycles with a total of 1 gigabyte of updated dataSoftware wear leveling capability for cycling extension and specific cases
- 20 years data retention
- Available in a TSSOP20 and UFQFPN32 wettable flank package
- External interfaces:
- ISO/IEC7816-3 (ST Reserved test feature)
- Slave serial peripheral interface (SPI) up to 10 MHz
- Slave I²C interface up to 1 Mb/s
- Class C (1.8 V), Class B (3 V) and 3.3 V supply voltage ranges
- ESD protection greater than 4 kV (HBM)
- CC EAL 6+ certified
- Software features
- Java® Card 3.0.5 classic operating system
- GlobalPlatform® 2.3 support
- Support for GlobalPlatform® SCP03 and SCP11
- Support for GlobalPlatform® ELF upgrade
- Android Ready SE Alliance secure element
- Dynamic memory management
- APDU communication over I²C/SPI based on the GlobalPlatform® APDU Transport over I2C/SPI specification
- Firmware upgrade mechanism
- Support of multiple logical secure element for hypervisor support
- In certification CC EAL5+ according to Java® Card open protection profile
- Proprietary Java® Card API for key derivation function (KDF)
- Proprietary Java® Card API for elliptic curves operations
- Hardware features
Recommended documentation
EDA符号、封装和3D模型
STMicroelectronics - STSAFE-V500
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| STSAFE-V500 | 评估 | TSSOP-20 | 汽车应用 | N/A | |
STSAFE-V500
Package:
TSSOP-20Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（ºC） | Operating Temperature (°C) (min) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| STSAFE-V500 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | TSSOP-20 | Tape and Reel | FRANCE | 3A991.a.2 | NEC | 0 | - | 0 | |||
STSAFE-V500 评估