产品概述
描述
SMD D2PAK封装的T2535T-8G三端双向可控硅可用于通用交流开关中的开/关或相角控制功能。
基于意法半导体的Snubberless技术，它具有更高的指定关断换向和噪音抗扰度，最高可达150°C。
SMD D2PAK封装适用于自动装配线。
T2535T-8G可针对家用电器空间最为有限的环境，安全地优化对电机和加热器负载的控制。
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所有功能
- 25 A中等电流三端双向可控硅元件
- 150 °C最高结温TJ
- 浪涌能力 = VDSM, VRSM = 900 V
- 3个触发象限
- 高噪音抗扰度 - 静态dV/dt
- 稳定可靠的动态关断换向 - (dI/dt)c
- 符合ECOPACK2的元件
eDesignSuite
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Thermal-electrical Simulators for Components
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AC Switches Simulator
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STPOWER Studio
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NFC Tuning Circuit
NFC Inductance
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EDA符号、封装和3D模型
STMicroelectronics - T2535T-8G
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
SPICE models (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 6.0 | 26 Jan 2021 | 26 Jan 2021 |
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| T2535T-8G-TR | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | D2PAK | - | - | CHINA | | ||
distributors
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