-
This device offers high thermal performance during operation of up to 20 ARMS, thanks to a junction temperature of up to 150 °C.
Its D²PAK package allows modern SMD designs as well as compact back to back configuration.
The combination of noise immunity and low gate triggering current allows to design strong and compact control circuits.主要特性
- High junction temperature: Tj = 150 °C
- High noise immunity dV/dt = 400 V/µs up to 150 °C
- Gate triggering current IGT = 10 mA
- Peak off-state voltage VDRM/VRRM = 600 V
- High turn on current rise dI/dt = 100 A/µs
- ECOPACK®2 compliant component
精选 视频
The STEVAL-DPSTPFC1 3.6 kW bridgeless totem pole boost circuit achieves a digital power factor correction (PFC) with inrush current limiter (ICL). It helps you to design an innovative topology with the latest ST power kit devices: a silicon carbide MOSFET (SCTW35N65G2V), a thyristor SCR (TN3050H-12WY), an isolated FET driver (STGAP2S) and a 32-bit MCU (STM32F334).
All resources
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 29 Aug 2017 |
29 Aug 2017
|
应用手册 (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
|
|||
| 03 Apr 2020 |
03 Apr 2020
|
|||
| 15 Jan 2019 |
15 Jan 2019
|
|||
| 03 Jun 2020 |
03 Jun 2020
|
技术文档 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 |
25 Aug 2020
|
宣传册 (5 of 7)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 28 Sep 2020 |
28 Sep 2020
|
|||
| 29 Nov 2019 |
29 Nov 2019
|
|||
| 18 Nov 2020 |
18 Nov 2020
|
|||
| 11 Jun 2020 |
11 Jun 2020
|
|||
| 25 May 2018 |
25 May 2018
|
|||
| 29 Nov 2018 |
29 Nov 2018
|
|||
| 02 Nov 2020 |
02 Nov 2020
|
手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Mar 2020 |
23 Mar 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - TN2010H-6G
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
硬件型号、CAD库及SVD (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 23 Sep 2019 |
23 Sep 2019
|
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TN2010H-6G |
批量生产
|
D2PAK | 工业 | Ecopack2 | |
| TN2010H-6G-TR |
批量生产
|
D2PAK | 工业 | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| TN2010H-6G | 2 distributors | Buy Direct |
批量生产
|
EAR99 | NEC | Tube | D2PAK | - | - | 150 | CHINA | 0.54 / 10 | ||
| TN2010H-6G-TR | 2 distributors |
批量生产
|
EAR99 | NEC | Tape And Reel | D2PAK | - | - | 150 | CHINA | 0.54 / 10 | |||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
0.54 / 10