产品概述
描述
This device offers high thermal performance during operation of up to 20 ARMS, thanks to a junction temperature of up to 150 °C. Its D²PAK package allows modern SMD designs as well as compact back to back configuration.The combination of noise immunity and low gate triggering current allows to design strong and compact control circuits.
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所有功能
- High junction temperature: Tj = 150 °C
- High noise immunity dV/dt = 400 V/µs up to 150 °C
- Gate triggering current IGT = 10 mA
- Peak off-state voltage VDRM/VRRM = 600 V
- High turn on current rise dI/dt = 100 A/µs
- ECOPACK®2 compliant component
精选 视频
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特别推荐
All tools & software
EDA符号、封装和3D模型
STMicroelectronics - TN2010H-6G
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
SPICE models (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 6.0 | 26 Jan 2021 | 26 Jan 2021 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TN2010H-6G | 批量生产 | D2PAK | 工业 | Ecopack2 | |
| TN2010H-6G-TR | 批量生产 | D2PAK | 工业 | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||
| TN2010H-6G | 1 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tube | D2PAK | - | - | 150 | CHINA | 0.585 / 10 | ||
| TN2010H-6G-TR | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape And Reel | D2PAK | - | - | 150 | CHINA | 0.585 / 10 | |||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
0.585 / 10