产品概述
描述
The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.
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所有功能
- 2.4 – 2.5 GHz balun with integrated matching network
- Matching optimized for following chipsets: ATSAMR21E18
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass bumpless
- Small footprint 2.5 mm²
EDA符号、封装和3D模型
STMicroelectronics - BALF-ATM-01E3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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符号
封装
3D模型
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
CAD Symbol & Footprint models (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 | |
| ZIP | 1.0 | 30 Aug 2021 | 30 Aug 2021 |
样片和购买
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| 产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度（ºC） | Minimum Sellable Quantity | Operating Temperature (°C) (min) | Minimum Sellable Quantity | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||||
| BALF-ATM-01E3 | | | distributors 无法联系到经销商，请联系我们的销售办事处 | FLIP CHIP BUMPLESS CSPG | Tape and Reel | FRANCE | EAR99 | NEC | -40 | 105 | 5000 | -40 | 5000 | |||
BALF-ATM-01E3 批量生产
Budgetary Price (US$)*/Qty:
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distributors
无法联系到经销商，请联系我们的销售办事处
封装:
FLIP CHIP BUMPLESS CSPG
包装类型:
Tape and Reel
RoHS:
-
Country of Origin:
FRANCE
ECCN (US):
EAR99
ECCN (EU):
NEC
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