产品概述
描述
This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.-
所有功能
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
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All tools & software
EDA符号、封装和3D模型
全部资源
Resource title | 版本 | Latest update |
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CAD Symbol & Footprint models (2)
Resource title | 版本 | Latest update | ||
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ZIP | 1.0 | 08 Jun 2021 | 08 Jun 2021 | |
ZIP | 1.0 | 07 Jun 2021 | 07 Jun 2021 |
样片和购买
产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Minimum Sellable Quantity | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
最小值 | 最大值 | ||||||||||||||
BALF-SPI2-01D3 | 6 distributors | 批量生产 | EAR99 | NEC | Tape and Reel | Chip Scale Package 0.4mm pitch | - | - | 5000 | FRANCE | | 0.19 | FRANCE |
BALF-SPI2-01D3 批量生产
封装:
Chip Scale Package 0.4mm pitch
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-