产品概述
描述
This device is an ultra-miniature balun. The BALF-SPI2-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
-
所有功能
- 50 Ω nominal input / conjugate matched to ST S2-LP for 433 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
您可能还会喜欢...
特别推荐
EDA符号、封装和3D模型
全部资源
资源标题 | 版本 | 更新时间 |
---|
CAD Symbol & Footprint models (1)
资源标题 | 版本 | 更新时间 | ||
---|---|---|---|---|
ZIP | 1.0 | 09 Jun 2021 | 09 Jun 2021 |
样片和购买
产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Minimum Sellable Quantity | Country of Origin | Budgetary Price (US$)*/Qty | 单价(US$) | Country of Origin | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
最小值 | 最大值 | ||||||||||||||
BALF-SPI2-02D3 | distributors 无法联系到经销商,请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | Chip Scale Package 0.4mm pitch | 40 | 105 | 5000 | FRANCE | | 0.19 | FRANCE |
BALF-SPI2-02D3 批量生产
封装:
Chip Scale Package 0.4mm pitch
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商,请联系我们的销售办事处