我们广泛的蓝牙低功耗应用处理器产品组合采用蓝牙5.3连接协议栈，其中包括经优化的网络和应用处理器，以及将两者集成在单晶片产品中的一体化解决方案。最多有6种封装可供选择（从QFN32到CSP100），可适应任何尺寸或功能集要求。
经优化的超低功耗无线前端，结合出色的RF链路和高效的电源管理架构，将电池寿命从数月延长至数年，使意法半导体的解决方案成为照明、智能家居、信标器、健身追踪器、胰岛素泵、助听器或任何节能型应用的理想选择。
具有快速固件升级功能的蓝牙芯片
片上非易失性内存支持简单快速的固件升级，包括通过固件认证和加密件（如果需要）进行现场无线 (OTA) 升级。
我们的多款蓝牙低功耗5.3器件在并发模式下支持专有协议以及802.15.4协议。
意法半导体的蓝牙低功耗模块配备板载天线、晶振和RF巴伦，可提供成熟可靠的解决方案，确保产品快速上市。它们与嵌入式蓝牙协议栈一起提供经过认证的蓝牙资格认证专家 (BQE) 解决方案，该解决方案完全获得RED、IC和FCC批准，确保快速集成到最终应用并提供易于使用的解决方案。
我们的蓝牙低功耗IC与模块由一套齐全的评估板、软件开发套件、应用说明和设计指南提供支持 – 可促进蓝牙无线连接技术在各应用领域的广泛应用。
特别推荐
Bluetooth LE 5.2 certified SoC enables extended range connectivity in lightweight applications
The BlueNRG-LP Programmable Bluetooth® LE 5.2 Wireless SoC supports advanced BLE features including long-range mode (Coded PHY), 2 Mbps transfers, Low Energy power control and advertisement extensions. Both radio and SoC architectures, including the flexible I/O peripherals, are highly optimized to achieve the lowest power consumption while offering uncompromised RF performance and a stunning 112 dB dynamic range for robust and reliable wireless connectivity.
Nicely tailored for lightweight applications, the SoC runs on the widely adopted Arm Cortex®-M0+ core, Arm’s most energy efficient processor, that processes user code in the embedded memories (25 Kbytes of Flash memory and 64 Kbytes of RAM) at a very low 14 µA/MHz and up to 64 MHz.
Developers can easily jump start their designs and debug prototypes thanks to the WiSE-Studio Eclipse IDE (STSW-WISE-STUDIO), our free GCC-based toolchain, and our BlueNRG-LP software development kit (STSW-BNRGLP-DK).
Designed to simplify evaluation cycles, the BlueNRG-LP evaluation board (STEVAL-IDB011V1) with onboard sensors and expansion connectors to further ease the start of new designs and shorten development time.