产品概述
描述
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
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所有功能
- Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx
- LGA footprint compatible
- 50 Ω nominal impedance on antenna side
- Deep rejection harmonics filter
- Low insertion loss
- Small footprint
- Low thickness ≤ 450 μm
- High RF performance
- RF BOM and area reduction
- ECOPACK2 compliant
特别推荐
EDA符号、封装和3D模型
STMicroelectronics - MLPF-WB55-01E3
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符号
封装
3D模型
全部资源
| Resource title | 版本 | Latest update |
|---|
CAD Symbol & Footprint models (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 27 May 2020 | 27 May 2020 | |
| ZIP | 1.0 | 27 May 2020 | 27 May 2020 |
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| MLPF-WB55-01E3 | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | FLIP CHIP BUMPLESS CSPG | -40 | 105 | CHINA | | ||
distributors
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