On-demand Webinar: Enhancing power density in SMPS with MasterGaN: the world’s first System-in-Package based on GaN
MasterGaN is the world’s first advanced System-in-Package integrating a 600V gate driver and two enhancement mode GaN High Electron Mobility Transistors (HEMTs) in a half-bridge configuration, with all necessary protection mechanisms built-in.
Since the initial release of the MasterGaN1 in 2020, we have extended the product family with MasterGaN2, which includes new features to further extend the efficiency gains, size reduction, and weight savings of topologies such as active clamp flyback.
This on-demand session covers the following:
- Benefits of GaN technology in SMPS
- ST´s MasterGaN family: overview and roadmap
- MasterGaN usage: possible topologies, maximum frequency, max power
- Discover our evaluation boardxamples
Bonus: live Q&A session included with feedback from ST’s experienced speakers.
Technical Marketing Manager at STMicroelectronics
Ester Spitale holds an MSc in Electronic Engineering (2004) and Ph.D. in Electrical Engineering from the University of Catania (2009). She joined STMicroelectronics in 2005. After 6 years designing analog controllers for SMPS, Ester has spent the last 9 years in technical marketing for analog and power across the EMEA region, focusing on power conversion ICs.
Application Engineer at STMicroelectronics
Jakub Jirsa holds a master's degree in Electrical Engineering from the Czech Technical University. He has been working as an Application Engineer at ST in Prague since 2016, focusing on digitally-controlled power supplies and GaN products. His current research interests include enhanced control techniques for high power density SMPS.