Quickly and easily develop prototypes for automotive e-mobility applications
Effectively test third generation ST silicon-carbide MOSFETs featuring top-side cooling HU3PAK package in half-bridge topology
TSC2020 current-sense amplifier ensures high accuracy and reduces BOM in industrial and automotive applications.
The highly integrated STM32U0 MCUs reduce power consumption and enable more design freedom in entry-level, battery-operated devices.
Run MPU-like applications with the new STM32H7 lines. Enjoy more design freedom and simplified development.
MEMS accelerometer with AI lets you develop sustainable, always-on, always-aware user and asset tracking applications.
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Nuremberg, Germany 9 - 11 Apr 2024
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