To better meet the stringent requirements of today's automobile industry, our ACEPACK™ SMIT and HU3PAK surface-mount packages with top-side cooling ensure higher power density and improved thermal management for very efficient and more compact systems.
As the performance of a semiconductor device depends on its temperature, how it behaves can vary substantially depending on its package's construction and how it's mounted on a circuit board (PCB). To ensure a chip's performance complies with its specifications and to avoid failure, it is very important to correctly manage the transfer of heat between the chip and its environment.
Why ST's ACEPACK SMIT and HU3PAK SMD packages with top-side cooling are ideal for high-performance automotive and industrial applications.
Compared to standard surface-mount packages, power modules in SMD packages with top-side cooling offer a smaller form factor, better thermal performance and higher design flexibility.
In packages with top-side cooling, the semiconductor chip is connected to a direct bonded copper (DBC) ceramic substrate on the top side of the package. This means that the power module, which is directly mounted on the surface of the circuit board (PCB), can be directly connected to an external heatsink in order to ensure the maximum power dissipation and optimize thermal performance.
Moreover, this enables the PCB-module-heat sink stack to be automatically assembled, ensuring a lower profile and more cost-effective production.
All automotive-grade HU3PAK packages are AEC-Q101 qualified, while ACEPACK SMIT packages are both AQG 324 and AEC-Q101 qualified depending on the internal dice configuration.