ACEPACK SMIT: automotive-grade isolated top-side cooling package
Flexible design for multiple power devices
Improved design flexibility offers high efficiency and superior thermal performance
Improved design flexibility offers high efficiency and superior thermal performance
The automotive-grade ACEPACK SMIT features a Direct Bond Copper (DBC) metal-isolation-metal substrate on the top side, enhancing thermal coupling with heatsinks. This design reduces silicon dissipation on the PCB, enabling lower temperatures and greater design flexibility. With low electrical parasitic inductance and thermal resistance, it supports various electrical circuit solutions suitable for e-mobility applications as well as industrial ones.
Electro-mobility
- On-board chargers (OBC)
- DC/DC converters for EV/HEV
- Traction inverters
- E-compressors
Energy generation and distribution
- Microinverters
- Solar inverters (string and central)
- EV charging
Industrial power supply
- Power supply units (PSU)
- Uninterruptable power supplies (UPS)
Motor control
- AC motor drives
- DC motor drives
- Servo motor drives
- HVAC
Why choose ACEPACK SMIT package?
- Key features
- AQG 324 qualified
- Top side cooling with low thermal resistance
- SMD for automatic stack assembly
- Direct Bond Copper (DBC) substrate
- Backside Insulated Ceramic, UL recognized
- Halogen free molding compound
- Improved creepage distances
- 6.6 mm minimum lead-to-lead
- Key benefits
- Molded and isolated thermal pad
- Very high thermal dissipation
- Kelvin source pin enables higher efficiency
- Suitable for several switch technologies
- Several topologies can be realized
- Automotive-grade
- Available in Tape and Reel (T&R)
| Topology | Discover more | Start your design |
|---|---|---|---|
| IGBTs | Half bridge/ | ||
| Si MOSFETs | Half bridge | ||
| SiC MOSFETs | Half bridge | ||
| Diodes | Ultrafast bridge | ||
| Thyristors (SCRs) | Half bridge/ |
| Topology | Discover more | Start your design |
|---|---|---|---|
| IGBTs | Half bridge/ | ||
| Si MOSFETs | Half bridge | ||
| SiC MOSFETs | Half bridge | ||
| Diodes | Ultrafast bridge | ||
| Thyristors (SCRs) | Half bridge/ |
- Key features
- AQG 324 qualified
- Top side cooling with low thermal resistance
- SMD for automatic stack assembly
- Direct Bond Copper (DBC) substrate
- Backside Insulated Ceramic, UL recognized
- Halogen free molding compound
- Improved creepage distances
- 6.6 mm minimum lead-to-lead
- Key benefits
- Molded and isolated thermal pad
- Very high thermal dissipation
- Kelvin source pin enables higher efficiency
- Suitable for several switch technologies
- Several topologies can be realized
- Automotive-grade
- Available in Tape and Reel (T&R)
Get started with the ACEPACK SMIT
STPOWER Studio online electro-thermal simulation software
STPOWER Studio online electro-thermal simulation software
This easy-to-use design aid offers comprehensive power and thermal analysis, predicting device performance to shorten the design cycle and save time and resources. Additionally, the tool assists users in selecting the best device for a specific application mission profile.
Solid-state 60 A industrial AC switch reference design
Solid-state 60 A industrial AC switch reference design
Ready-to-use reference design featuring a pulse transformer for 60 A 1200 V industrial switching applications based on a top-side-cooled ACEPACK SMIT package.