Industrial IGBT-based top-side cooling ACEPACK SMIT package
1200 V, 50 A in half-bridge topology
Highly efficient solution for high-power, three-phase inverters for servo drives, HVAC, and GPI
Highly efficient solution for high-power, three-phase inverters for servo drives, HVAC, and GPI
The 1200 V STGSH50M120D integrates IGBTs and diodes in a half-bridge configuration in a single ACEPACK SMIT package. The device combines the robustness of M series trench gate field-stop IGBTs with the superior thermal and reliability performance of the top-side cooling ACEPACK SMIT surface mount package.
AC motor drives
DC motor drives
Servo motor drives
HVAC
Address your design performance challenges using...
ACEPACK SMIT half-bridge topology 1200 V, 50 A,
M series IGBT with diode
ACEPACK SMIT half-bridge topology 1200 V, 50 A,
M series IGBT with diode
- TFS 1200 V Low-Loss M series
- Low VCEsat = 1.8 V @ICN
- Better trade-off between conduction and switching performance
- Short-circuit rugged (10us @VBUS = 600 V and TJstart = 150°C)
- Soft and fast recovery freewheeling co-packed diode
- SMD assembly and top side cooling
- Isolation provided by DBC substrate with good thermal dissipation
- Kelvin pins to increase efficiency
STEVAL-ISD01KCB: 22kW high-end servo drive with SIL 2 assessment
STEVAL-ISD01KCB: 22kW high-end servo drive with SIL 2 assessment
Designed to address all the application use cases, requiring high-power capability, safety function SIL 2 level in the servo motor actuation, with a compact form factor. Safety is ensured with the introduction of Safe Torque Off (STO), Safe Brake Control (SBC) and all the diagnostic functions and architectural solution to achieve the SIL 2 safety level and PLd performance level. The power stage includes our STGSH50M120D working at max operating voltage 800 V.
STPOWER Studio online electro-thermal simulation software
STPOWER Studio online electro-thermal simulation software
This easy-to-use design aid offers comprehensive power and thermal analysis, predicting device performance to shorten the design cycle and save time and resources. Additionally, the tool assists users in selecting the best device for a specific application mission profile.