Enhanced design possibilities for consumer and industrial applications
Enhanced design possibilities for consumer and industrial applications
The ST67W611M modules deliver certified Wi-Fi® 6 and Bluetooth® LE connectivity, seamlessly integrating with STM32 MCUs or MPUs to add wireless capabilities. Future-ready, they support the Matter protocol (available Q4 2025) and Thread (available Q2 2026) through software updates, ensuring compatibility with the latest IoT standards.
The ST67 series marks the first milestone in the collaboration between STMicroelectronics and Qualcomm Technologies, paving the way for innovative wireless solutions.
Key features
- Built on Qualcomm Technologies processor
- Wi-Fi® 6 / Bluetooth® LE / Thread combo
- Supports Matter protocol over Wi-Fi® for future-proof connectivity
- Up to 20 dBm output power
- Wi-Fi® and Bluetooth® LE certification target
- Embedded 4 Mbytes of flash memory with OTA capability
- Embedded 40 MHz crystal
- Integrated hardware cryptographic acceleration
- PSA Certified Level 1
- Connectivity software integration within the STM32 ecosystem
Key benefits
Applications
Get started
Flexible prototyping with expansion board
Build prototypes and test new ideas effortlessly and affordably with the expansion board integrating the ST67W611M1 module.
Optimized reference design
Ensure optimal performance and design with a proven layout and BOM for the ST67W611M1 and STM32U575AI in a compact form factor.
Comprehensive software package
Accelerate development with an expansion package offering complete middleware for Wi-Fi® and Bluetooth® LE applications.
STM32 Explore | On-demand webinar
Enable faster wireless innovation and design scalability with the ST67W Wi-Fi® 6 module