New coprocessor modules
Enhanced design possibilities for consumer and industrial applications
Enhanced design possibilities for consumer and industrial applications
The ST67W611M modules deliver certified Wi-Fi® 6 and Bluetooth® LE connectivity, seamlessly integrating with STM32 MCUs or MPUs to add wireless capabilities. Future-ready, they will support the Matter protocol (Q3 2025) and Thread (Q4 2025) through software updates, ensuring compatibility with the latest IoT standards.
The ST67 series marks the first milestone in the collaboration between STMicroelectronics and Qualcomm Technologies, paving the way for innovative wireless solutions.
Key features
- Built on Qualcomm Technologies processor
- Wi-Fi® 6 / Bluetooth® LE / Thread combo
- Supports Matter protocol over Wi-Fi® for future-proof connectivity
- Up to 20 dBm output power
- Wi-Fi® and Bluetooth® LE certification target
- Embedded 4 Mbytes of flash memory with OTA capability
- Embedded 40 MHz crystal
- Integrated hardware cryptographic acceleration
- PSA Certified Level 1
- Connectivity software integration within the STM32 ecosystem
Key benefits
Integrated connectivity
Leverage a self-contained module compatible with STM32 products, offering seamless integration with an MCU-based plug-in solution.
Reliable wireless performance
Pre-loaded with Wi-Fi® 6 and Bluetooth® LE, featuring Matter over Wi-Fi® support and powered by Qualcomm Technologies’ connectivity.
STM32 Cube compatible
Tap into the STM32 ecosystem and simplify development with the STM32Cube software expansion package offering user-friendly APIs.
Applications
Smart homes
Industrial IoT
Smart appliances
Get started
Flexible prototyping with expansion board
Build prototypes and test new ideas effortlessly and affordably with the expansion board integrating the ST67W611M1 module.
Optimized reference design
Ensure optimal performance and design with a proven layout and BOM for the ST67W611M1 and STM32U575AI in a compact form factor.
Comprehensive software package
Accelerate development with an expansion package offering complete middleware for Wi-Fi® and Bluetooth® LE applications.