Automotive-grade IGBT in ACEPACK SMIT package with half-bridge topology
650 V, 80 A, high-speed IGBT with freewheeling diode
Specifically designed to maximize efficiency in resonant and soft-switching applications, the STGSH80HB65DAG combines IGBTs and diodes in a half-bridge topology, housed in a single package. The device features 650V trench field-stop IGBTs, optimized for soft commutation, and low-drop freewheeling diodes assembled in an isolated surface-mount (SMD) package with top-side cooling for excellent thermal performance thanks to a DBC substrate.
This application note provides guidelines for mounting, handling, and soldering ACEPACK SMIT module packages. It also provides thermal considerations linked to heatsink types and assembly methods.