Product overview
Description
STMicroelectronics BAL-CC1101-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC1101 / CC1150 TI transceiver.
It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.
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All features
- 50 Ω nominal input / conjugate match to CC1101 / CC1150
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on glass
- Small footprint: < 2.1 mm²
Recommended for you
All resources
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Product Specifications (1)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| 3.0 | 04 May 2016 | 04 May 2016 |
Application Notes (1)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| 2.0 | 25 Jul 2025 | 25 Jul 2025 |
Presentations (2)
| Resource title | Version | Latest update | |||
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| 1.0 | 24 Jan 2023 | 24 Jan 2023 | |||
| 2.0 | 05 May 2023 | 05 May 2023 |
Flyers (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| 1.0 | 26 Jan 2023 | 26 Jan 2023 | |||
| 1.0 | 24 Jan 2023 | 24 Jan 2023 |
Brochures (2)
| Resource title | Version | Latest update | |||
|---|---|---|---|---|---|
| 12.24 | 17 Dec 2024 | 17 Dec 2024 | |||
| 1.0 | 01 Aug 2015 | 01 Aug 2015 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BAL-CC1101-01D3
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Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
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CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | |||
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| ZIP | 1.0 | 06 Aug 2021 | 06 Aug 2021 | ||
| ZIP | 1.0 | 06 Aug 2021 | 06 Aug 2021 |