Arcing-resistant package extends MOSFETs portfolio
ST has extended its offering of
MOSFETs with a new package option, the fully isolated TO-220FP wide creepage. It features an improved creepage (4.25 mm pin distance) for a higher level of protection against high voltage arcing failures. It eliminates the special potting, lead forming, sleeving, or sealing needed to prevent the arcing when using conventional packages with 2.54 mm lead spacing, resulting in simplified manufacturing and reduced system cost.
High voltage arcing can occur due to dust entering the case, which reduces the effect of the creepage. Thanks to the wider creepage, this package option meets the demanding needs of open frame power supplies such as those found in TVs and PCs.