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ST’s power MOSFET portfolio offers a broad range of breakdown voltages from –100 to 1700 V, with low gate charge and low on-resistance, combined with state-of-the art packaging. ST’s process technology for both high-voltage power MOSFETs (MDmesh™) and low-voltage power MOSFETs (STripFET™) ensures an enhanced power handling capability, resulting in high-efficiency solutions. Power MOSFETs are belonging to the STPOWER™ family.

The main features of our wide MOSFET portfolio include:

  • –100 to 1700 V breakdown voltage range
  • More than 30 package options including the 4-lead TO-247 featuring a dedicated control pin for increased switching efficiency, the H2PAK for high-current capability, the very innovative surface-mount TO-LL leadless, the 1-mm-high surface-mount PowerFLAT™ family, from 2 x 2 mm up to 8 x 8 mm for low-voltage, high-voltage and very-high-voltage power MOSFETs featuring excellent thermal performance thanks to a large exposed metal drain pad
  • Improved gate charge and lower on-state resistance to meet today’s challenging efficiency requirements
  • Intrinsic fast body diode option for selected product lines
  • Wide portfolio of automotive-grade power MOSFETs
  • Application-oriented technologies

In any voltage range for Industrial and Automotive applications such as Switch Mode Power Supplies (SMPS), Lighting, Motor Control, Energy Generation and Electro Mobility, Chassis & Safety, Body & Convenience, ST has the right power MOSFET for your design.

Our wide STPOWER™ product portfolio combined with state-of-the art packaging and protections for high reliability and safety helps designers find the right solutions for customized, high-efficiency applications that will last a long lifetime.

Featured Products

Automotive MOSFETs in tiny 5x6 mm dual-side cooling package

ST has extended its offering of AEC-Q101 MOSFETs with the introduction of two 40 V devices in the advanced PowerFLAT™ 5x6 dual-side cooling (DSC) package with wettable flanks. The STLD200N4F6AG and STLD125N4F6AG, with a maximum on-resistance of 1.5 mΩ and 3.0 mΩ respectively, ensure high efficiency and help simplify system thermal management. The 0.8 mm-high PowerFLAT 5x6 DSC retains the footprint and thermally efficient bottom-side design of the standard wettable flank package, while it exposes the top-side source electrode to further enhance heat dissipation. This allows a higher current rating that increases power density, enabling designers to build smaller ECUs without trading off functionality, performance, or reliability.

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