High-performance and DSP with FPU, ARM Cortex-M7 MCU with 512 Kbytes Flash, 216 MHz CPU, Art Accelerator, L1 cache, SDRAM

The STM32F722xx and STM32F723xx devices are based on the high-performance ARM® Cortex®-M7 32-bit RISC core operating at up to 216 MHz frequency. The Cortex®-M7 core features a single floating point unit (SFPU) precision which supports ARM® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances the application security.

The STM32F722xx and STM32F723xx devices incorporate high-speed embedded memories with a Flash memory up to 512 Kbytes, 256 Kbytes of SRAM (including 64 Kbytes of data TCM RAM for critical real-time data), 16 Kbytes of instruction TCM RAM (for critical real-time routines), 4 Kbytes of backup SRAM available in the lowest power modes, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memories access.

All the devices offer three 12-bit ADCs, two DACs, a low-power RTC, thirteen general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG). They also feature standard and advanced communication interfaces.

Key Features

  • Core: ARM® 32-bit Cortex® -M7 CPU with FPU, adaptive real-time accelerator (ART Accelerator™) and L1-cache: 8 Kbytes of data cache and 8 Kbytes of instruction cache, allowing 0-wait state execution from embedded Flash memory and external memories, frequency up to 216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1) and DSP instructions.
  • Memories
    • Up to 512 Kbytes of Flash memory with protection mechanisms (read and write protections, proprietary code readout protection (PCROP))
    • 528 bytes of OTP memory
    • SRAM: 256 Kbytes (including 64 Kbytes of data TCM RAM for critical real-time data) + 16 Kbytes of instruction TCM RAM (for critical real-time routines) + 4 Kbytes of backup SRAM (available in the lowest power modes)
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
  • Dual mode Quad-SPI
  • Clock, reset and supply management
    • 1.7 V to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power
    • 4-to-26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC (1% accuracy)
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Low-power
    • Sleep, Stop and Standby modes
    • VBAT supply for RTC, 32×32 bit backup registers + 4 Kbytes of backup SRAM
  • 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
  • 2×12-bit D/A converters
  • Up to 18 timers: up to thirteen 16-bit (1x low- power 16-bit timer available in Stop mode) and two 32-bit timers, each with up to 4 IC/OC/PWMs or pulse counter and quadrature (incremental) encoder inputs. All 15 timers running up to 216 MHz. 2x watchdogs, SysTick timer
  • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
  • Debug mode
    • SWD & JTAG interfaces
    • Cortex® -M7 Trace Macrocell™
  • Up to 140 I/O ports with interrupt capability
    • Up to 136 fast I/Os up to 108 MHz
    • Up to 138 5 V-tolerant I/Os
  • Up to 21 communication interfaces
    • Up to 3× I2 C interfaces (SMBus/PMBus)
    • Up to 4 USARTs/4 UARTs (27 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
    • Up to 5 SPIs (up to 54 Mbit/s), 3 with muxed simplex I2 Ss for audio class accuracy via internal audio PLL or external clock
    • 2 x SAIs (serial audio interface)
    • 1 x CAN (2.0B active)
    • 2 x SDMMCs
  • Advanced connectivity
    • USB 2.0 full-speed device/host/OTG controller with on-chip PHY
    • USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and on-chip Hi-speed PHY or ULPI depending on the part number
  • True random number generator
  • CRC calculation unit
  • RTC: subsecond accuracy, hardware calendar
  • 96-bit unique ID

Circuit Diagram

bd_stm32f723xe_512k.jpg

Design

Publications and Collaterals

Flyers
Description Version Size
Get ready for the largest IoT development ecosystem 17.02 741 KB
STM32 GUI solutions - Advanced HMI now achievable on embedded systems 1.0 1 MB
STM32 Nucleo boards 18.0 1 MB
STM32 for makers Releasing your creativity 16.09 1 MB
Brochures
Description Version Size
STM32™ 32-bit MCU family - Leading supplier of ARM® Cortex®-M microcontrollers 18.0 1 MB
STM32F7 series - ARM® Cortex®-M7 powered 17.02 1 MB

HW Model & CAD Libraries

HW Model & CAD Libraries
Description Version Size
STM32F7 Boundary Scan Decription Language (BSDL) files 3 179 KB
STM32F7 CAD Symbol and Footprint files 1.1 3 MB
STM32F7 IBIS models 3.0 61 MB

Presentations & Training Material

Presentations
Description Version Size
STM32 Embedded Software overview 2.3.0 777 KB
STM32 and STM8 embedded software solutions 2.0 2 MB

Technical Documentation

Product Specifications
Description Version Size
DS11853 DS11853: ARM® Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 512KB Flash /256+16+4KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF 2.0 3 MB
Technical Notes & Articles
Description Version Size
TN1163 TN1163: Description of WLCSP for microcontrollers and recommendations for its use 4.0 1 MB
TN0830 TN0830: How to use EWARM 6.2x with projects built with EWARM 6.1 and previous versions 1.2 97 KB
TN1204 TN1204: Tape and reel shipping media for STM32 microcontrollers in BGA packages 2.1 745 KB
TN1205 TN1205: Tape and reel shipping media for STM8 and STM32 microcontrollers in FPN packages 3.0 753 KB
TN1206 TN1206: Tape and reel shipping media for STM8 and STM32 microcontrollers in QFP packages 3.0 830 KB
TN1207 TN1207: Tape and reel shipping media for STM8 and STM32 microcontrollers in SO packages 1.0 755 KB
TN1208 TN1208: Tape and reel shipping media for STM8 and STM32 microcontrollers in TSSOP and SSOP packages 1.0 743 KB
Reference Manuals
Description Version Size
RM0431 RM0431: STM32F72xxx and STM32F73xxx advanced ARM®-based 32-bit MCUs 1.0 15 MB
Programming Manuals
Description Version Size
PM0253 PM0253: STM32F7 Series Cortex®-M7 processor programming manual 3.0 4 MB
Errata Sheets
Description Version Size
ES0360 ES0360: STM32F72xxx and STM32F73xxx device limitations 1.0 293 KB

Tools and Software

Development Tools
Embedded Software
Evaluation Tools
Hardware Development Tools
Software Development Tools
MCUs Embedded Software
Product Evaluation Tools
Support & Community


Sample & Buy

Part Number Package Packing Type Operating Temperature (°C) (min) Operating Temperature (°C) (max) Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors
STM32F723IEK6 BGA 176 Tray -40 85 Active 7.349 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
STM32F723IET6 LQFP 176 24x24x1.4 Tray -40 85 Active 7.049 10000 NEC 3A991A2 PHILIPPINES MORE INFO DISTRIBUTOR AVAILABILITY
STM32F723IEK7 BGA 176 - -40 105 Proposal - - - - - MORE INFO
STM32F723IET7 LQFP 176 24x24x1.4 Tray -40 105 Active 7.541 10000 NEC 3A991A2 PHILIPPINES MORE INFO
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(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32F723IEK6 ActiveBGA 176IndustrialEcopack2
STM32F723IET6 ActiveLQFP 176 24x24x1.4IndustrialEcopack2
STM32F723IEK7 ProposalBGA 176Industrial -
STM32F723IET7 ActiveLQFP 176 24x24x1.4IndustrialEcopack2
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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