Revision history

Table 24. Document revision history
Date	Version	Changes
24-May-2018	1	Initial release.
4-Mar-2019	2	Updated: Title of the document Section 2.3 Thermal model of a chip carrier Section 3.3 Ambient temperature versus junction temperature Section 3.5 Board temperature Section 4 Power dissipation and cooling methods Added: Section 3.6 STM32 thermal parameters Section 6 Thermal analysis example
19-Apr-2019	3	Updated Section 3.6 STM32 thermal parameters. Added Section 6.2 Discovery kit with STM32H747XI MCU.
28-Feb-2023	4	Updated: Section orders between Section 6.1 and Section 6.2 Section 6.2 Evaluation board with STM32MP157 MPU Figure 3. HDC (heat dissipation capability) Added Section 6.3 Internal validation board with STM32MP135 MPU
11-Oct-2023	5	Updated: Document title Figure 20 Junction temperature-dependent dissipated power for STM32MP135 (cpuburn)
28-Jun-2024	6	Added Internal validation board with STM32MP257 MPU
21-Nov-2024	7	Added Discovery kit with STM32N657XOH3 MCU
19-Jan-2026	8	Updated document title Added Internal validation board with STM32MP215F MPU