The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DLC the sensing element of the accelerometer and of the gyro are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
Delivering high accuracy and stability with ultra-low power consumption (0.75 mA in high-performance, combo mode) enables, also in the industrial domain, long-lasting battery-operated applications.
The ISM330DLC includes a dedicated configurable signal processing path with low latency, low noise and dedicated filtering specifically intended for control loop stability. Data from this dedicated signal path can be made available through an auxiliary SPI interface, configurable for both the gyroscope and accelerometer. High-performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the preferred choice of system designers for the creation and manufacturing of versatile and reliable products.
The ISM330DLC is available in a plastic, land grid array (LGA) package.
|DS12171: iNEMO inertial module: 3D accelerometer and 3D gyroscope with digital output for industrial applications||2.0||3 MB|
|AN5125: ISM330DLC: 3D accelerometer and 3D gyroscope with digital output for industrial applications||1.0||2 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance||1.0||616 KB|
|ISM330DLC iNEMO® 6-axis inertial module for Industry 4.0||1.0||741 KB|
|AEC-Q100-qualified for smart automotive applications||01.2018||1 MB|
|MEMS and Sensors, Smart solutions for IoT and enhanced user experience||1 MB|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (EU)||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|ISM330DLCTR||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tape And Reel||Active : Product is in volume production||2.9||1000||NEC||EAR99||PHILIPPINES||MORE INFO||DISTRIBUTOR AVAILABILITY|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|ISM330DLCTR||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.