iNEMO inertial module, 3-axis accelerometer, 3-axis gyroscope for Industry 4.0 applications, digital output, low power

The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

In the ISM330DLC the sensing element of the accelerometer and of the gyro are implemented on the same silicon die, thus guaranteeing superior stability and robustness.

The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

Delivering high accuracy and stability with ultra-low power consumption (0.75 mA in high-performance, combo mode) enables, also in the industrial domain, long-lasting battery-operated applications.

The ISM330DLC includes a dedicated configurable signal processing path with low latency, low noise and dedicated filtering specifically intended for control loop stability. Data from this dedicated signal path can be made available through an auxiliary SPI interface, configurable for both the gyroscope and accelerometer. High-performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the preferred choice of system designers for the creation and manufacturing of versatile and reliable products.

The ISM330DLC is available in a plastic, land grid array (LGA) package.

Key Features

  • 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
  • 3D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
  • Analog supply voltage: 1.71 V to 3.6 V
  • SPI & I²C serial interface with main processor data synchronization
  • Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters for control loop stability (OIS and other stabilization applications)
  • Auxiliary SPI serial interface for independent, low-noise low-latency data output for gyroscope and accelerometer
  • Ultra-low power consumption for both accelerometer and gyroscope enabling long-lasting battery-operated applications: 0.5 mA in combo normal mode and 0.75 mA in combo high-performance mode
  • Smart FIFO up to 4 kbyte
  • Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
  • Sensor hub feature to efficiently collect data from additional external sensors
  • Embedded hard, soft ironing for external magnetic sensor corrections
  • Embedded temperature sensor
  • Embedded self-test both for gyroscope and accelerometer
  • High shock survivability
  • Extended operating temperature range (-40°C to +85°C)
  • ECOPACK® , RoHS and “Green” compliant


Technical Documentation

Product Specifications
Description Version Size
DS12171 DS12171: iNEMO inertial module: 3D accelerometer and 3D gyroscope with digital output for industrial applications 2.0 3 MB
Application Notes
Description Version Size
AN5125 AN5125: ISM330DLC: 3D accelerometer and 3D gyroscope with digital output for industrial applications 1.0 2 MB
Technical Notes & Articles
Description Version Size
TN0018 TN0018: Surface mounting guidelines for MEMS sensors in an LGA package 6.0 214 KB
Design Notes & Tips
Description Version Size
DT0064 DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0 616 KB

Publications and Collaterals

Description Version Size
ISM330DLC iNEMO® 6-axis inertial module for Industry 4.0 1.0 741 KB
Description Version Size
AEC-Q100-qualified for smart automotive applications 01.2018 1 MB
MEMS and Sensors, Smart solutions for IoT and enhanced user experience 1 MB

Tools and Software

Embedded Software
MEMS and Sensors Software
Evaluation Tools
Product Evaluation Tools
Support & Community

Sample & Buy

Part Number Package Packing Type Marketing Status Unit Price (US$) * Quantity ECCN (EU) ECCN (US) Country of Origin More info Order from ST Order from Distributors

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Quality & Reliability

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
ISM330DLCTR ActiveVFLGA2.5X3X.86 14L P.5 L.475X.25Ecopack2

(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.