Section

Applications Notes
 

Four applications notes have been edited to cover the main technical aspect in relation to the Lead-free conversion.

Applications Notes
AN2033 Soldering Resistance and Moisture Sensitivity Level (MSL) Classification of STMicroelectronics Lead-Free Devices
AN2034 Soldering Compatibility (Backward and Forward)
AN2035 Control of Whiskers growth in Tin alloy coating
AN2036 Solderability Tests

 

 

Related Topics
Lead-free Conversion Program
Conversion Roadmap
  - Summary
  - Detailed
  - Memory Products
Lead-free solutions
Quality & Reliability
  - Compatibility
  - Reliability
  - MSL
Identification & Traceability
Product Selector
Application Notes
Chemical Content
Definitions & Regulations
  - ECOPACK®
  - E3/E4 Initiative
  - PCNs & PIL
  - RoHS   
  - WEEE   
Publications
  - Whisker Formation
  - Whiskers on Lead-free
     plating
  - Whiskers testing reality
     or fiction ?
  - Pure tin plating
     qualification

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