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All Pb-free Surface Mount Devices (SMD) have been re-qualified according
to the JEDEC STD-020B compliant soldering profiles considering 2 classes
of packages, so called “large” and “small”, which can be respectively
exposed to a soldering profile with the peak at 245°C and 250°C.
The JEDEC STD-020C specification issued in July 2004 is considering
3 classes of packages and 3 peak temperatures: 245°C, 250°C and 260°C,
a number of packages moving from the previous “245°C peak” category
to the new “260°C peak” category.
It is anticipated that some of them may have their MSL changed, for
which every effort will be made to improve the encapsulation materials.
This may take up to one year (see application note
AN2033). The MSL is indicated on labels according to IPC/JEDEC Standard
J-STD033.
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