| ST has the unique ability to offer smartcard ICs in wafers and
advanced micromodules and packages. These packages combine integration
and security. All these packages are ECOPACK® versions, compliant
with the European directive 2002/95/EC relating to restrictions
on hazardous substances (RoHS). |
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| Micromodules and Packages |
ST can provide efficient, fast and complete product testing
in Micromodules or surface mount plastic packages. To complement
Smartcard IC delivery in wafer format ST has a sophisticated packaging
operation, which ensures high quality in high volumes without
neglecting the importance of security throughout the assembly,
testing and delivery phases. |
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| A wide range of advanced micromodules |
| A wide range of Micromodule packages - Contact modules (D68, D95,
D15, D17), Contactless modules (C79, CA2/CA4/CB4) and dual modules
(D70)- combine integration and security. Delivery on tape and reel
with full documentation and traceability. |
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| New Applications, New Packaging Options |
| With the use of Smartcard technology becoming more widespread
and their security features recognized as being important in several
new fields/applications, the demand for surface mount technology
is growing. To address these market requirements ST offers packages
such as SO20, TSSOP28 and TQFP44, TFBGA64 and soon MLP8 5x6. |
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TFBGA64 |
SO20 |
TQFP44 |
TSSOP28 |
MPL8 |
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