Company
ST Home | Product Technologies | Advanced Packaging | Ultra Small Leadless Packages

Ultra Small Leadless Packages
Very thin Fine pitch Quad Flat Pack Nolead Packages (VFQFPN)
Very thin Fine pitch Quad Flat Pack Nolead packages are ideal for portable applications requiring small size and low weight while needing high thermal and electrical performance. VFQFPN packages are particularly suitable for RF and low pin count applications.

Even if these packages are leadless and with exposed die-pad they are based on existing and well established metallic lead-frames technologies.
Ultra Small Leadless Packages
 
Very thin Fine pitch Quad Flat Pack Nolead Packages (VFQFPN)
 
VFQFPN Packages Availability - Lead Pitch 0.5mm
Pin Package Size Max Die Size Lead Length
12 3mm x 3mm package size - 1.7mm 0.55mm
16 3mm x 3mm package size - 1.3mm 0.35mm
20 4mm x 4mm package size - 1.7mm 0.55mm
28 5mm x 5mm package size - 1.7mm 0.55mm
36 6mm x 6mm package size - 1.7mm 0.55mm
44 7mm x 7mm package size - 1.7mm 0.55mm
52 8mm x 8mm package size - 1.7mm 0.55mm
 

Related Topics
System-on-Chip
ASIC
MEMS
Lab-on-Chip
Advanced Packaging
Support
Lead Free/RoHS
Package Information