Conversion from UFBGA169 to TFBGA169 boards
The UFBGA169 and TFBGA169 packages are compatible. However, it is important to note that the TFBGA169 balls have a larger diameter than the UFBGA169 balls, while the pitch of both packages is the same. To ensure compatibility between the two packages, STMicroelectronics recommends maintaining a 280 µm solder mask opening on the PCB. Additionally, customers must consider the height difference between the TFBGA169 and UFBGA169 packages when designing their application.