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MEMS digital output motion sensor: ultra low-power high performance 3-axes nano accelerometer
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The LIS3DSH is an ultra low-power high performance three-axis linear accelerometer belonging to the “nano” family with embedded state machine that can be programmed to implement autonomous applications.

The LIS3DSH has dynamically selectable full scales of ±2g/±4g/±6g/±8g/±16g and it is capable of measuring accelerations with output data rates from 3.125 Hz to 1.6 kHz.

The self-test capability allows the user to check the functioning of the sensor in the final application.

The device can be configured to generate interrupt signals activated by user defined motion patterns.

The LIS3DSH has an integrated first in, first out (FIFO) buffer allowing the user to store data for host processor intervention reduction.

The LIS3DSH is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

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Key Features

  • Wide supply voltage, 1.71 V to 3.6 V
  • Independent IOs supply (1.8 V) and supply voltage compatible
  • Ultra low-power consumption
  • ±2g/±4g/±6g/±8g/±16g dynamically selectable full-scale
  • I2C/SPI digital output interface
  • 16-bit data output
  • Programmable embedded state machines
  • Embedded temperature sensor
  • Embedded self-test
  • Embedded FIFO
  • 10000 g high shock survivability
  • ECOPACK® RoHS and “Green” compliant

Design Resources


Technical Documentation

Product Specifications

Description Version Size
DS8721: MEMS digital output motion sensor ultra low-power high performance three-axis “nano” accelerometer
1.0 1,105 KB

Application Notes

Description Version Size
AN2328: HID device coding example
1.1 54 KB
AN3182: Tilt measurement using a low-g 3-axis accelerometer
1.3 255 KB
AN3393: LIS3DSH: 3-axis digital output accelerometer
4.0 2,208 KB
AN4156: Hardware abstraction layer for Android
1.0 370 KB
AN4508: Parameters and calibration of a low-g 3-axis accelerometer
1.0 304 KB
AN4509: Tilt measurement using a low-g 3-axis accelerometer
1.0 250 KB

Technical Notes & Articles

Description Version Size
TN0018: Surface mounting guidelines for MEMS sensors in an LGA package
5.0 218 KB

Design Notes & Tips

Description Version Size
DT0011: Benefits in using FIFO buffer embedded in ST MEMS sensors
1.0 618 KB

Related Tools and Software

Related Tools and Software

Part Number Description
STSW-MEMS024 LIS3DSH Linux OS device driver
iNEMOEngine_PI3P PI3P engine PRO - platform independent
iNEMOEngine_PAAP PAAP engine PRO - Android Platform
STEVAL-MKI134V1 LIS3DSH adapter board for standard DIL24 socket
iNEMOEngine_PW8 PW8 engine PRO - supports Win8 sensors

Publications and Collaterals


Description Version Size
3-axis digital accelerometers for smarter, easier-to-use and energy-efficient portable devices
2.0 892 KB


Description Version Size
MEMS and Sensors, Smart solutions for IoT and enhanced user experience
6.0 1,594 KB
Peripheral semiconductors for set-top box applications
634 KB

White Paper

Description Version Size
Mechanical characterization and simulation of fracture processes in polysilicon MEMS
1.0 9,933 KB
Physical Sensors Drive MEMS Consumerization Waves
1.0 886 KB

Sample & Buy

Part Number Marketing StatusPackagePacking TypeAutomotive GradeOrder From STUnit Price (US$)*
@ 1000
Distributor AvailabilityRoHS Compliance GradeDownload
Material Declaration**
LIS3DSHTRActiveLLGA 16 3x3x1.0Tape And Reel_Free SamplesDistributor reported inventory date: 2015-10-10
Distributor NameRegionStockMin. order
ARROWOrder NowEUROPE840000

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
(**) The Material Declaration forms available on may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
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