The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
The LSM6DS3 is available in a plastic land grid array (LGA) package.
|DS10591: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope||10.0||1 MB|
|AN4650: LSM6DS3: always-on 3D accelerometer and 3D gyroscope||5.0||1 MB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214 KB|
|DT0053: 6-point tumble sensor calibration||1.0||464 KB|
|DT0059: Ellipsoid or sphere fitting for sensor calibration||2.0||409 KB|
|DT0060: Exploiting the gyroscope to update tilt measure and e-compass||1.0||226 KB|
|DT0047: How to install and run the osxMotionAR Activity Recognition library||1.3||275 KB|
|DT0064: Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance||1.0||616 KB|
|iNEMO® always-on 6-axis inertial module||1.0||648 KB|
|MEMS and Sensors, Smart solutions for IoT and enhanced user experience||1 MB|
|X-CUBE-MEMS-XT1||ST||Sensor and DSP algorithm software expansion for STM32Cube|
|X-CUBE-MEMS1||ST||Sensor and motion algorithm software expansion for STM32Cube|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (EU)||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM6DS3TR||VFLGA 2.5X3X0.86 14L||Tape And Reel||Active : Product is in volume production||1.771||1000||NEC||EAR99||-||MORE INFO||Get Sample Add to cart||DISTRIBUTOR AVAILABILITY|
|LSM6DS3||VFLGA 2.5X3X0.86 14L||Tray||Active : Product is in volume production||-||-||NEC||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LSM6DS3TR||Active||VFLGA 2.5X3X0.86 14L||Ecopack2|
|LSM6DS3||Active||VFLGA 2.5X3X0.86 14L||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.