-
The HSP061-4NY8 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 5 Gbps.
The device is packaged in μQFN-8L with a 400 μm pitch, which minimizes the PCB area.Key Features
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 6 GHz
- Ultralow capacitance: 0.6 pF
- Low time domain reflection
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- Package size in mm: 2 x 1 x 0.5
- RoHS compliant
- Benefits
- High ESD robustness of the equipment
- Suitable for high density boards
- Complies with following standards
-
MIL-STD 883G Method 3015-7 Class 3B:
- 8 kV
-
IEC 61000-4-2 level 4:
- 8 kV (contact discharge)
- 15 kV (air discharge)
-
MIL-STD 883G Method 3015-7 Class 3B:
Featured Videos
This video is presenting ESD protections and Integrated Passives around the MCU
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
All tools & software
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Sep 2016 |
19 Sep 2016
|
Application Notes (5)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 06 Aug 2019 |
06 Aug 2019
|
|||
| 06 Aug 2019 |
06 Aug 2019
|
|||
| 14 Dec 2015 |
14 Dec 2015
|
|||
| 13 Sep 2018 |
13 Sep 2018
|
|||
| 13 Sep 2018 |
13 Sep 2018
|
Technical Notes & Articles (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 09 Dec 2020 |
09 Dec 2020
|
|||
| 25 Aug 2020 |
25 Aug 2020
|
Presentations (4)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 18 Nov 2019 |
18 Nov 2019
|
|||
| 18 May 2015 |
18 May 2015
|
|||
| 18 Dec 2015 |
18 Dec 2015
|
|||
| 18 May 2015 |
18 May 2015
|
Flyers (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 07 Sep 2020 |
07 Sep 2020
|
|||
| 02 Mar 2020 |
02 Mar 2020
|
Brochures (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 29 Jun 2020 |
29 Jun 2020
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP061-4NY8
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
HW Model, CAD Libraries & SVD (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 18 Nov 2019 |
18 Nov 2019
|
||
| ZIP | 17 Mar 2020 |
17 Mar 2020
|
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| HSP061-4NY8 |
Active
|
QFN-8L | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||
| HSP061-4NY8 | 4 distributors | Free Sample Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | QFN-8L | -40 | 150 | 6 | Uni-Directional | CHINA | 0.228 / 100 | ||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
