Product overview
Description
The HSP061-4NY8 is a 4-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth and the low reflection make it compatible with 5 Gbps.The device is packaged in μQFN-8L with a 400 μm pitch, which minimizes the PCB area.
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All features
- Flow-through routing to keep signal integrity
- Ultralarge bandwidth: 6 GHz
- Ultralow capacitance: 0.6 pF
- Low time domain reflection
- Low leakage current: 100 nA at 25 °C
- Extended operating junction temperature range: -40 °C to 150 °C
- Package size in mm: 2 x 1 x 0.5
- RoHS compliant
- Benefits
- High ESD robustness of the equipment
- Suitable for high density boards
- Complies with following standards
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MIL-STD 883G Method 3015-7 Class 3B:
- 8 kV
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IEC 61000-4-2 level 4:
- 8 kV (contact discharge)
- 15 kV (air discharge)
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MIL-STD 883G Method 3015-7 Class 3B:
Featured Videos
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
During this one-hour webinar, you will learn how to make your electronic system more robust against destructive Electrostatic Discharges (ESD) by using ST ESD Protection components. Agenda : 1) ESD major root causes and EMC standards, 2) ST ESD Protections which can help to protect your application againts ESD, 3) Many real application examples demonstrating where protections play an important role, 4) How to select the best protection for your usecases
This video is presenting ESD protections and Integrated Passives around the MCU
All tools & software
EDA Symbols, Footprints and 3D Models
STMicroelectronics - HSP061-4NY8
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
SPICE models (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 18 Nov 2019 |
18 Nov 2019
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CAD Symbol & Footprint models (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 17 Jun 2021 |
17 Jun 2021
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| ZIP | 1.0 | 17 Mar 2020 |
17 Mar 2020
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Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| HSP061-4NY8 |
Active
|
QFN-8L | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||
| HSP061-4NY8 | 3 distributors | Free Sample Buy Direct |
Active
|
EAR99 | NEC | Tape And Reel | QFN-8L | -40 | 150 | 6 | Uni-Directional | CHINA | 0.261 / 100 | ||
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors