SD2918
RF power transistor HF/VHF/UHF n-channel MOSFETs
Features
Gold metallization Excellent thermal stability Common source configuration POUT = 30 W min. with 18 dB gain @ 30 MHz
Description
The SD2918 is a n-channel MOS field-effect RF power transistor. It is intended for use in 50 V dc large signal applications up to 200 MHz. Figure 1.
M113 Epoxy sealed
Pin connection
4
1
1. Drain 2. Source 3. Gate
3
2 4. Source
Table 1.
Device summary
Marking SD2918 Package M113 Packaging Plastic tray
Order code SD2918
November 2009
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Contents
SD2918
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 1.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 D ynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 4 5 6 7 8
Impedance data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical performances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Test circuit and BOM list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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Electrical data
1
1.1
Electrical data
Maximum ratings
Table 2.
Symbol V(BR)DSS VDGR VGS ID PDISS TJ TSTG
Absolute maximum ratings (TCASE = 25 C)
Parameter Drain source voltage Drain-gate voltage (RGS = 1 M) Gate-source voltage Drain current Power dissipation Max. operating junction temperature Storage temperature Value 125 125 20 6 175 200 -65 to +150 Unit V V V A W C C
1.2
Thermal data
Table 3.
Symbol RthJ-C RthC-S
Thermal data
Parameter Junction-case thermal resistance Junction-heatsink thermal resistance(1) Value 1.0 C/W 0.3 Unit
1. Determined using a flat aluminum or copper heatsink with thermal compound applied (dow corning 340 or equivalent).
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Electrical characteristics
SD2918
2
Electrical characteristics
TCASE = +25 oC
2.1
Static
Table 4.
Symbol V(BR)DSS IDSS IGSS VGS(Q) VDS(ON) gFS CISS COSS CRSS VGS = 0 V VGS = 0 V VGS = 20 V VDS = 10 V VGS = 10 V VDS = 10 V VGS = 0 V VGS = 0 V VGS = 0 V
Static
Test conditions IDS = 10 mA VDS = 50 V VDS = 0 V ID = 10 mA ID = 2.5 A ID = 2.5 A VDS = 50 V VDS = 50 V VDS = 50 0 V f = 1 MHz f = 1 MHz f = 1 MHz 0.8 58 35.5 7.5 1.0 Min 125 1.0 1 5.0 5.0 Typ Max Unit V mA A V V mho pF pF pF
2.2
Dynamic
Table 5.
Symbol POUT GPS hD
Dynamic
Test conditions VDD = 50 V, IDQ = 100 mA, f = 30 MHz, PIN= 0.475 W VDD = 50 V, IDQ = 100 mA, f = 30 MHz, Pout= 30 W VDD = 50 V, IDQ = 100 mA, f = 30 MHz, Pout= 30 W Min 30 18 50 30:1 22 55 Typ Max Unit W dB % VSWR
VDD = 50 V, IDQ = 100 mA, f = 30 MHz, Pout= 30 W Load mismatch All phase angles
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Impedance data
3
Impedance data
Figure 2. Impedance data
D
ZD L Typical Input Impedance Typical Drain Load Impedance
G Zin
S
Table 6.
Impedance data
Freq 30 MHz ZIN () 24.4 - j 13.4 ZDL () 28.8 + j 7.2
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Typical performances
SD2918
4
Figure 3.
Typical performances
Capacitance vs drain-source voltage Figure 4. Maximum thermal resistance vs case temperature
Figure 5.
Drain current vs gate voltage
Figure 6.
Gate-source voltages vs case temperature
Figure 7.
Output power vs input power
Figure 8.
Output power vs input power at different TC
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Typical performances
Figure 9.
Output power vs supply voltage
Figure 10. Output power vs gate voltage
Figure 11. Power gain and efficiency vs output power
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Test circuit and BOM list
SD2918
5
Test circuit and BOM list
Figure 12. 30 MHz test circuit schematic
VB
+
+50V
+
RF INPUT RF OUTPUT
Table 7.
Component R4 R3 R2 R1 FB3 FB2 FB1 L3
Bill of material
Part n. CR2512-1W-101JB 29SJ901 29SJ901 CR2512-1W-3R9JT 2843000102 2743021447 2743021447 8073 Supplier VENKEL XICON XICON VENKEL Description 100 1 W surface mount chip , resistor 160 1 W carbon film axial-lead , resistor 160 1 W carbon film axial-lead , resistor 3.9 1 W surface mount chip resistor ,
FAIR-RITE CORP. Multi-aper ture core FAIR-RITE CORP. Shield bead surface mount EMI FAIR-RITE CORP. Shield bead surface mount EMI BELDEN Inductor, 3 turns air wound #14AWG, ID= 0.375[9.53], poly coated magnet wire Inductor, 7 turns around shield bead (PT# Fair-rite 2643801102) #16AWG hook up wire. Inductor, 4 turns air wound #14AWG, ID= 0.375[9.53], poly coated magnet wire
L2
1557
ALPHA
L1
8073
BELDEN
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SD2918 Table 7.
Component C10 C9 C8 C7 C6 C5 C4 C3 C2 C1
Test circuit and BOM list Bill of material (continued)
Part n. SKA100M160 C1812X7R501-103KNE C1812X7R501-103KNE C1812X7R501-103KNE RVS-50V100M-R C1812X7R501-103KNE ATC200B103KW50X 463 ATC200B103KW50X ATC200B103KW50X Supplier MALLORY VENKEL VENKEL VENKEL ELNA VENKEL ATC ARCO ATC ATC Description 10 F/160 V axial-lead aluminium electrolytic capacitor 0.01 F/500 V surface mount ceramic chip capacitor 0.01 F/500 V surface mount ceramic chip capacitor 0.01 F/500 V surface mount ceramic chip capacitor 10 F/50 V vertical surface mount chip aluminium electrolytic capacitor 0.01 F/500 V surface mount ceramic chip capacitor 10000 pF ATC 200B surface mount ceramic chip capacitor 20-180 pF type ST46 standard 3 turns variable capacitor 10000 pF ATC 200B surface mount ceramic chip capacitor 10000 pF ATC 200B surface mount ceramic chip capacitor Transformer: 4:9, 75.0 o.d. 0.090 1" , LG. coaxial cable 5 turns around shield bead (PT#2643801002 FAIRRITE CORP.) Transformer: 9:4, 75.0 o.d. 0.090 1" , LG. coaxial cable 5 turns around shield bead (PT#2643801002 FAIRRITE CORP.) G0300M1026 ROGERS CORP. Woven fiberglass reinforced PTFE 0.030" THK, r = 2.55, 2Oz ED Cu both sides
T2
T1
PCB
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Circuit layout
SD2918
6
Circuit layout
Figure 13. 30 MHz test circuit photomaster
REF. 7143542A
Figure 14.
30 MHz production test fixture
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Package mechanical data
7
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
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Package mechanical data Table 8.
Dim. Min A B C D E F G H I J K 6.22 3.05 5.59 19.81 18.29 24.64 9.40 0.10 2.16 4.06 Typ Max 5.84 20.83 18.54 24.89 9.78 0.15 2.67 4.57 7.14 6.48 3.30 0.245 0.120 Min 0.220 0.780 0.720 0.970 0.370 0.004 0.085 0.160 Typ
SD2918
M113 (.380 DIA 4/L N/HERM W/FLG) mechanical data
mm. Inch Max 0.230 0.820 0.730 0.980 0.385 0.006 0.105 0.180 0.281 0.255 0.130
Figure 15. Package dimensions
Controlling dimensions: inches
101093 6D
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Revision history
8
Revision history
Table 9.
Date 21-Jun-2004 05-Nov-2009
Document revision history
Revision 1 2 First release Updated marking on Table 1. Changes
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SD2918
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