VD6725
2 megapixel, 1/5 inch system-on-chip imaging sensor
Data Brief
Features
UXGA (2 megapixel) sensor array 1/5" optical format, 1.75 m pixel size SNR max > 36 dB 10-bit continuous-time single-end ADC Selectable 8-bit parallel or CSI2 serial output Integrated high-performance image signal processor and camera controller 4-channel radial anti-vignetting dynamic singlet/couplet correction adaptive noise reduction high-quality scaler: any size scaling down from SXGA electronic zoom 15 frames per second (fps) at full resolution, 30 fps in VGA with fast context switching feature for quicker still image capture Programmable I2C chip address Low power consumption and ultra-low standby current 1 Kbit OTP memory fully available to user Integrated 1.2 V regulator TSV wafer level package option
Appl ication s
Mobile phones PDAs PC cameras and peripherals Gaming platforms
Description
VD6725 is an ultra-small, ultra-competitive and ultra-smart 2 megapixel 1/5" SOC imaging sensor with a high-performance image signal processor. VD6725 imaging sensor allows design of ultra-low height camera modules, thanks to ST's pixel ultralow optical stack height that provides high quantum efficiency, better light sensitivity and improved relative illumination. This cost competitive solution resulting from an ultra-small sensor die size is based on ST's innovative sensor architecture and ST's latest imaging patents, combined to our new imaging process. ST's new high performance imaging process provides 1.75 m pixel size, very high logic density, excellent SNR and low light performance. It is qualified in our 8" and 12" world-leading manufacturing infrastructures.
Benefits
Compatible with camera modules with Z height below 4 mm Compatible with camera modules < 6 x 6 mm Flexible applications (//ITU, MIPI) using the same die Creative special effects Qualified for reflowable camera modules
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January 2008
Rev 2
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www.st.com
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For further information contact your local STMicroelectronics sales office.
Overview
VD6725
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Overview
Figure 1. VD6725 block diagram
Wafer level package: TSV (through-silicon via)
The wafer-level package, TSV (through-silicon via) technology, is used to design smaller camera modules, improve the assembly yield and lower costs. The VD6725 is available in ST's revolutionary TSV package:
Ultra-scaled down camera module size No wire bonding inside the camera module: save up to 1.6 mm in X and Y No substrate in the module: directly reflowable, on phone mother board or flex-attach Up to 400 m saved in module Z height No leads on the package sides for an increased reliability and ESD protection
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Ordering information
Table 1. Ordering information
Description Tested, sawn dice on reconstructed wafer.
Order code VD6725/SW
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Revision history
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Revision history
Table 2.
Date 25-Jan-2008 31-Jan-2008
Document revision history
Revision 1 2 Initial release. Clarified the feature on OTP memory in the Features. Changes
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