FC30
MEMS functional sensor: smar t 3D orientation and click detection standalone device
Features
3D orientation sensor: 3 orthogonal directions (6 positions) Embedded click/double-click functionality Low power consumption Power down mode High shock survivability -40 C to +85 C temperature range Excellent quality and reliability Testable after assembly without movement Housed in a small, thin 3x5x0.9 SMD package ECOPACK, RoHS and "Green" compliant The device can be used for image rotation (portrait/landscape) and position-based applications. When a single or double mechanical tap is detected, the FC30 provides an interrupt signal, enabling a "mouse button-like" function for intuitive man-machine interface solutions. A power-down mode selectable through a dedicated input pin ensures very low current consumption in battery-operated devices. The FC30 is available in an LGA-14 3x5x0.9mm SMD plastic full-moulded package compliant with lead-free, RoHS and halogen-free regulations. Compatible with a -40 C to +85 C temperature range, the FC30 is shipped in standard tape and reels for automatic pick and place machines and is washable after reflow due to its completely sealed and hermetic structure.
LGA-14 (3x5x0.9mm)
Applications
Image rotation in mobile phones & portable devices Digital photo frames Orientation detection Button replacement Motion triggered wake up
Description
The FC30 is a stand-alone 3D orientation and click/double-click detection device. When in a steady position, it is able to detect 6 different orientations with respect to the gravity field, with notification provided through dedicated signal lines.
Table 1.
Order codes
Temp range ( C) -40 to +85 -40 to +85 Package LGA-14 LGA-14 Packing Tray Tape and reel
Order code FC30 FC30TR
May 2008
Rev 1
1/13
www.st.com 13
Contents
FC30
Contents
1 2 Pin configuration and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Device functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 2.2 2.3 2.4 Orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1.1 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Tap detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Post assembly device verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Power down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 3.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4 5
Device and technology information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 7
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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FC30
Pin configuration and description
1
Pin configuration and description
Figure 1. Pin configuration
Face
Port
1
Land
1
6
6 8
13
13
8
TOP VIEW
BOTTOM VIEW
Table 2.
Pin# 1 2 3 4 5 6 7 8 9 10 11 12 13-14
Pin description
Name Vdd_IO GND Vdd Res GND Vdd Res PC LC Res PD SIGN Res Power supply for I/O pins 0V supply Power supply Connect to 0V supply 0V supply Power supply Leave unconnected Por trait interrupt (logic 1: portrait orientation) Landscape interrupt (logic 1: landscape orientation) Connect to 0V supply Power-down (logic 0: normal mode; logic 1: power-down mode) Sign interrupt for landscape/portrait/face orientation Leave unconnected Function
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Device functionality
FC30
2
2.1
Device functionality
Orientation detection
The device output can be configured to provide its orientation relative to gravity based on orientation definitions, as illustrated in Figure 2 below. Figure 2. Orientation definitions
Portrait Up
Landscape Left
Landscape Right
FC30
Portrait Down
Top Gravity Face Up Bottom Bottom Face Down Top
2.1.1
Output response vs. orientation
Figure 3 shows the three interrupt output lines for the selected orientation.
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FC30 Figure 3. Output response vs. orientation
LC = 1 PC = 0 PORT SIGN = 1 LEFT UP DOWN
Device functionality
Bottom Top Top
LC = 0 PC = 0 SIGN = 1
RIGHT LC = 1 PC = 0 PORT SIGN = 0
LC = 0 PC = 1 SIGN = 0
LC = 0 PC = 1 SIGN = 1
LC = 0 PC = 0 Bottom SIGN = 0
Gravity
LANDSCAPE
PORTRAIT
FACE
2.2
Tap detection
The device can be configured to send an interrupt signal on a dedicated pin when "clicked" in any direction (see Figure 4). A more advanced feature also allows the detection of a "double click" event, with a programmable time interval between the first and second click, to enable a "mouse buttonlike" functionality. These functions can be fully programmed. For additional information, please contact your local STMicroelectronics sales office. Figure 4. Tap or "click" detection
LC or PC interrupts FC30 Equipment with the FC30 mounted
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Device functionality
FC30
2.3
Post assembly device verification
A special function allows the user to check the sensor functionality without moving the device (device verification). This functionality is enabled by connecting the FC30 to an MCU. For the connection scheme and additional information, please contact your local STMicroelectronics sales office.
2.4
Power down
The power down function allows the device to be put in an ultra-low power consumption mode by applying a "logic 1" voltage value to the PD pad. In this state the measurement chain is powered off.
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FC30
Electrical specifications
3
3.1
Table 3.
Symbol Vdd Vdd_IO Idd IddPdn Ton Ac Top Wh
Electrical specifications
Electrical characteristics
Electrical characteristics(1) (2)
Parameter Supply voltage I/O pins supply voltage Supply current Current consumption in power-down mode Turn-on time(4) Accuracy(5) Operating temperature range Product weight -40 30 T = 25C T = 25C Test conditions Min. 2.16 1.71 0.3 1 30 3 +85 Typ.(3) 2.5 Max. 3.6 Vdd+0.1 0.4 Unit V V mA A ms deg C mg
1. The product is factory calibrated at 2.5 V. The device can be used from 2.16 V to 3.6 V 2. All the parameters are specified @ Vdd=2.5 V, T = 25 C unless otherwise noted 3. Typical specification are not guaranteed 4. Time to obtain valid data after exiting power-down mode 5. Accuracy defines the angle around the three orthogonal directions where orientation is detected (see Figure 5)
Figure 5.
Orientation accuracy angle
Gravity
Accuracy
3.2
Absolute maximum ratings
Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
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Electrical specifications Table 4.
Symbol Vdd, Vdd_IO Vin AMAX TOP TSTG
FC30
Absolute maximum ratings
Ratings Supply voltage and I/O pins supply voltage Input voltage on any control pin Acceleration (any axis, powered and unpowered) Operating temperature range Storage temperature range Maximum Value -0.3 to 6 -0.3 to Vdd_IO +0.3 10000 g for 0.1ms -40 to +85 -40 to +125 4.0 (HBM) Unit V V g C C kV V kV
ESD
Electrostatic discharge protection
200 (MM) 1.5 (CDM)
This is a Mechanical Shock sensitive device, improper handling can cause permanent damage to the part This is an ESD sensitive device, improper handling can cause permanent damage to the part
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FC30
Device and technology information
4
Device and technology information
The FC30 is an ultra-compact, low power 3-dimensional orientation and click/double-click sensor. Manufactured with MEMS technology, the FC30 offers many advantages compared to the conventional fabrication technology used nowadays in portable devices, including:
Potential for additional strong miniaturization, leveraging the characteristics of micromachining technology No surface friction effects, wear effects and acoustic noise generation Embedded electronic signal conditioning allows reduced power consumption
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Application hints
FC30
5
Application hints
Figure 6. FC30 electrical connection for 3D orientation detection
Vdd Vdd_IO
6
1
Face
10uF
Top VIEW
Port
1
Land
6
100nF
13 8
TOP VIEW
8
13
GND
Digital signal from/to signal controller.Signal's levels are defined by proper selection of Vdd_IO
The diagram above refers to the electrical connection scheme for application of 3D orientation detection. The device core is supplied through the Vdd line while the I/O pads are supplied through the Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 F Al) should be placed as near as possible to pin 6 of the device (common design practice). All the voltage and ground supplies must be present at the same time for proper behavior of the IC (Figure 6).
5.1
Soldering information
The LGA package is compliant with the ECOPACK, RoHS and "green" standards. Leave the pin 1 indicator unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com
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SIG N
PC
PD
LC
FC30
Package information
6
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 7. LGA 14: mechanical data and package dimensions
mm DIM. MIN. A1 A2 A3 D1 E1 e d L1 N N1 P1 P2 T1 T2 R h k i s 0.965 0.640 0.750 0.450 1.200 0.150 0.050 0.100 0.100 0.180 2.850 4.850 0.220 3.000 5.000 0.800 0.300 4.000 1.360 1.200 0.975 0.650 0.800 0.500 TYP. 0.920 M AX . 1.000 0.700 MIN. TYP. MAX. 0.0362 0.0394 0.0275 inch
OUTLINE AND MECHANICAL DATA
0.260 0.0071 0.0087 0.0102 3.150 0.1122 0.1181 0.1240 5.150 0.1909 0.1968 0.2027 0.0315 0.0118 0.1575 0.0535 0.0472 0.985 0.0380 0.0384 0.0386 0.660 0.0252 0.0256 0.0260 0.850 0.0295 0.0315 0.0335 0.550 0.0177 0.0197 0.0217 1.600 0.0472 0.0059 0.0020 0.0039 0.0039 0.0630
LGA14 (3x5x0.92mm) Pitch 0.8mm Land Grid Array Package
7773587 C
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Revision history
FC30
7
Revision history
Table 5.
Date 29-May-2008
Document revision history
Revision 1 Initial release Changes
12/13
FC30
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