Accelerate your STM32MP1 MPU design with SiP and SoM solutions
Join our 1-hour webinar to learn how System-in-Packages (SiPs) and System-on-Modules (SoMs) can optimize your MPU-based design and boost time to market!
Tuesday, February 16th 2021
► 3:00 pm CET (EMEA)
Designing a microprocessor-based system can be challenging, as it involves a series of complex tasks. Interfacing your processor to the DDR SDRAM, the non-volatile memory, the high-speed I/Os, the power management system, and other components, is very time consuming and requires significant resources – not to mention the complexity of signal integrity, PCB layout, and the need to ensure Electromagnetic Compatibility (EMC).
These obstacles can be overcome by using an STM32MP1-based SiP(1) or SoM(2), supplied by one of our partners. And in this webinar, we will show you how.
This webinar will provide you with the latest updates on the STM32MP1 MPU and help you understand the benefits of a SiP or SoM solution for your project.
Who should attend
Engineers, technicians and managers working on a project involving a microprocessor-based design including:
- Hardware architects, engineers, managers, technicians
- Software architects, engineers, managers
- Product marketing, managers
- Program/project managers
- Brief overview of STM32MP1 MPU portfolio and ecosystem
- Introduction to SiP and SoM solutions
- Advantages of SiP and SoM solutions
- Advantages of a discrete STM32MP1 MPU solution
- Discover STM32MP1 SiP and SoM Authorized Partners
After the webinar, there will be a 20-minute Q&A session where our experts will be available to answer any questions.
This webinar will be broadcast twice, at convenient times for international audiences. Please review the times listed below and register for the most appropriate option for your time zone.
- For EMEA: February 16th, 2021 at 3:00 pm CET
- For Americas: February 16th, 2021 at 2:00 pm EST
To participate in this free online event, simply register on my.st.com.
Mike Hartmann is a Microcontroller and Microprocessor Product Marketing Engineer in ST's Americas region. He has been with ST since 2001, and previously held various marketing and engineering roles in ST's Digital Product Group and Consumer Business Unit. Prior to ST, Mike worked at several communications and digital video technology companies. He has an MBA from the University of Delaware and a Bachelor’s degree in Electrical Engineering from Penn State University.
(1) A System-in-Package module embeds all the necessary components such as the MPU, the PMIC, the DDR, the passive components and the crystal oscillator in a single BGA package.
(2) A System-on-Module is a small PCB embedding the MPU, the PMIC, the DDR SDRAM, the Flash memory and passive components.