Product overview
概要
The ASM330LHHG1 is a 6-axis IMU featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with an extended temperature range up to +125°C, designed to address automotive nonsafety applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer markets. The ASM330LHHG1 is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
The ASM330LHHG1 has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
The device supports dual operating modes: high-performance mode and low-power mode.
All the design aspects of the ASM330LHHG1 have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHHG1 is available in an overmolded 14-lead plastic, land grid array (LGA) package.
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All features
- AEC-Q100 qualified
- Android Auto™ compliant and CarPlay® compliant
- Extended temperature range from -40 to +125°C
- Embedded compensation for high stability over temperature
- Accelerometer user-selectable full scale up to ±16 g
- Extended gyroscope range from ±125 to ±4000 dps
- Dual operating modes: high-performance and low-power mode
- I²C, MIPI I3C®, and SPI serial interfaces
- Six-channel synchronized output to enhance the accuracy of dead-reckoning algorithms
- Smart programmable interrupts
- Embedded 3 KB FIFO available to underload host processor
- ECOPACK and RoHS compliant
EDA Symbols, Footprints and 3D Models
STMicroelectronics - ASM330LHHG1
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Quality and Reliability
| Part Number | Marketing Status | Package | RoHSコンプライアンスグレード | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|
| ASM330LHHG1TR | Active 交換品交換品 | LGA 14L 2.5x3x0.86 mm | Ecopack2 | 15 | 2023-07-01T00:00:00.000+02:00 |
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Operating temperature (°C) | Operating Temperature (°C) (max) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小 | 最大 | |||||||||||||
| ASM330LHHG1TR | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください | |||||||||||
ASM330LHHG1TR Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。