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The LIS3DH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low-power operational modes that allow advanced power saving and smart embedded functions.
The LIS3DH has dynamically user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1 Hz to 5.3 kHz. The self-test capability allows the user to check the functioning of the sensor in the final application. The device may be configured to generate interrupt signals using two independent inertial wake-up/free-fall events as well as by the position of the device itself. Thresholds and timing of interrupt generators are programmable by the end user on the fly. The LIS3DH has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor. The LIS3DH is available in small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
主な特徴
- Wide supply voltage, 1.71 V to 3.6 V
- Independent IO supply (1.8 V) and supply voltage compatible
- Ultra-low-power mode consumption down to 2 μA
- ±2g/±4g/±8g/±16g dynamically selectable full scale
- I2C/SPI digital output interface
- 16-bit data output
- 2 independent programmable interrupt generators for free-fall and motion detection
- 6D/4D orientation detection
- Free-fall detection
- Motion detection
- Embedded temperature sensor
- Embedded self-test
- Embedded 32 levels of 16-bit data output FIFO
- 10000 g high shock survivability
- ECOPACK®, RoHS and “Green” compliant
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|
| LIS3DH | LLGA 16 3x3x1.0 | Tray |
Preview
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- | - | EAR99 | - | No availability of distributors reported, please contact our sales office | |
| LIS3DHTR | LLGA 16 3x3x1.0 | Tape And Reel |
Active
|
0.546 | 1000 | EAR99 | PHILIPPINES | 在庫チェック | Get sample |
LIS3DH
パッケージ
LLGA 16 3x3x1.0梱包タイプ
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
A bridge between the sensor on the mother board an your laptop
開発環境
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写真 製品型番 製造元 概要 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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ソフトウェア製品
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Standard C platform-independent drivers for MEMS motion and environmental sensors
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評価ツール
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写真 製品型番 製造元 概要 Hardware and firmware design SIANA Systems Complete hardware and firmware design for all applications SensiEDGE customization services SensiEDGE End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE! SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. 製品型番Complete hardware and firmware design for all applications
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| 製品型番 | 製品ステータス | パッケージ | RoHSコンプライアンスグレード | 材料宣誓書** |
|---|---|---|---|---|
| LIS3DH |
Preview
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LLGA 16 3x3x1.0 | Ecopack2 |
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| LIS3DHTR |
Active
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LLGA 16 3x3x1.0 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
