Product overview
概要
This power module realizes a fourpack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
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All features
- Fourpack topology
- ACEPACK 2 power module
- 23 mΩ of typical RDS(on) each switch
- Insulation voltage 2.5 kVrms
- Integrated NTC temperature sensor
- Integrated DC link capacitor
- DBC Cu-Al2O3-Cu based
- Press-fit contact pins
EDA Symbols, Footprints and 3D Models
STMicroelectronics - A2F20M65W3-FC
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