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The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.
The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.
The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.主な特徴
- 3 magnetic field channels and 3 acceleration channels
- ±50 gauss magnetic dynamic range
- ±2/±4/±8/±16 g selectable acceleration full scales
- 16-bit data output
- SPI / I2C serial interfaces
- Analog supply voltage 1.71 V to 3.6 V
- Selectable power mode/resolution for accelerometer and magnetometer
- Single measurement mode for magnetometer
- Programmable interrupt generators for free-fall, motion detection and magnetic field detection
- Embedded self-test
- Embedded temperature sensor
- Embedded FIFO
- ECOPACK®, RoHS and “Green” compliant
サンプル & 購入
| 製品型番 | パッケージ | 梱包タイプ | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|---|
| LSM303AGRTR | LGA 2X2X1 12LD PITCH 0.5MM | Tape And Reel | アクティブ | 1.485 | 1000 | EAR99 | - | 在庫チェック | |
| LSM303AGR | LGA 2X2X1 12LD PITCH 0.5MM | Tray | Evaluation | - | - | EAR99 | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください |
LSM303AGRTR
パッケージ
LGA 2X2X1 12LD PITCH 0.5MM梱包タイプ
Tape And ReelUnit Price (US$)
1.485*LSM303AGR
パッケージ
LGA 2X2X1 12LD PITCH 0.5MM梱包タイプ
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
開発環境
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写真 品名 製造元 概要 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 製品型番AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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写真 品名 製造元 概要 LSM303AGR click MikroElektronika LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer. 製品型番LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.
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ソフトウェア製品
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Sensor and motion algorithm software expansion for STM32Cube
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写真 品名 製造元 概要 AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) 製品型番Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
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Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
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評価ツール
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写真 品名 製造元 概要 
STEVAL-MKI172V1 ST LSM303AGR adapter board for a standard DIL 24 socket 製品型番LSM303AGR adapter board for a standard DIL 24 socket
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写真 品名 製造元 概要 
STEVAL-STLCS01V1 ST SensorTile connectable sensor node: plug or solder 
STEVAL-STLCS02V1 ST SensorTile connectable sensor node: solder only 製品型番SensorTile connectable sensor node: plug or solder
SensorTile connectable sensor node: solder only
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サポート & アプリケーション
| 製品型番 | 製品ステータス | パッケージ | RoHSコンプライアンスグレード | Material Declaration** |
|---|---|---|---|---|
| LSM303AGR | Evaluation | LGA 2X2X1 12LD PITCH 0.5MM | Ecopack2 | |
| LSM303AGRTR | アクティブ | LGA 2X2X1 12LD PITCH 0.5MM | Ecopack2 | |
LSM303AGR
Package:
LGA 2X2X1 12LD PITCH 0.5MMMaterial Declaration**:
LSM303AGRTR
Package:
LGA 2X2X1 12LD PITCH 0.5MMMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
