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Product overview

Description

The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor. The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I²C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.
The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

All features
3 magnetic field channels and 3 acceleration channels

±50 gauss magnetic dynamic range

±2/±4/±8/±16 g selectable acceleration full scales

16-bit data output

SPI / I²C serial interfaces

Analog supply voltage 1.71 V to 3.6 V

Selectable power mode/resolution for accelerometer and magnetometer
Single measurement mode for magnetometer

Programmable interrupt generators for free-fall, motion detection and magnetic field detection

Embedded self-test

Embedded temperature sensor

Embedded FIFO

ECOPACK^®, RoHS and “Green” compliant
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All tools & software

Components and Modules

Part number	Status	Description	Type	Supplier
LSM303AGR click	Active	LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.	Components and Modules	MikroElektronika	LSM303AGR click Description: LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.
SensiBLE	Active	Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!	Components and Modules	SensiEDGE	SensiBLE Description: Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
SensiBLE 2.0	Active	SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.	Components and Modules	SensiEDGE	SensiBLE 2.0 Description: SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
SensiBLE 2.1	Active	SensiBLE 2.1 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.	Components and Modules	SensiEDGE	SensiBLE 2.1 Description: SensiBLE 2.1 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
SensiSUB	Active	Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.	Components and Modules	SensiEDGE	SensiSUB Description: Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

Engineering Services

Part number	Status	Description	Type	Supplier
FAE Engineering Services	Active	Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.	Engineering Services	FAE Technology	FAE Engineering Services Description: Engineering services on the SensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
SensiEDGE customization services	Active	End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!	Engineering Services	SensiEDGE	SensiEDGE customization services Description: End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

MCU & MPU Embedded Software

Part number	Status	Description	Type	Supplier
X-CUBE-MEMS-XT1	NRND	Sensor and DSP algorithm software expansion for STM32Cube	STM32Cube Expansion Packages	ST	X-CUBE-MEMS-XT1 Description: Sensor and DSP algorithm software expansion for STM32Cube
X-CUBE-MEMS1	Active	Sensor and motion algorithm software expansion for STM32Cube	STM32Cube Expansion Packages	ST	X-CUBE-MEMS1 Description: Sensor and motion algorithm software expansion for STM32Cube

MEMS and Sensors Software

Part number	Status	Description	Type	Supplier
AndroidHAL-IIO	Active	Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)	Drivers for MEMS	ST	AndroidHAL-IIO Description: Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
AndroidHALInput	Active	Android sensor HAL for MEMS motion and environmental sensors (Input framework)	Drivers for MEMS	ST	AndroidHALInput Description: Android sensor HAL for MEMS motion and environmental sensors (Input framework)
C-Driver-MEMS	Active	Standard C platform-independent drivers for MEMS motion and environmental sensors	Drivers for MEMS	ST	C-Driver-MEMS Description: Standard C platform-independent drivers for MEMS motion and environmental sensors
LinuxDriverIIO	Active	Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)	Drivers for MEMS	ST	LinuxDriverIIO Description: Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
LinuxDriverInput	Active	Linux device drivers for MEMS motion and environmental sensors (Input framework)	Drivers for MEMS	ST	LinuxDriverInput Description: Linux device drivers for MEMS motion and environmental sensors (Input framework)

Product Evaluation Tools

Part number	Status	Description	Type	Supplier
STEVAL-MKI172V1	Active	LSM303AGR adapter board for a standard DIL 24 socket	MEMS Motion Sensor Eval Boards	ST	STEVAL-MKI172V1 Description: LSM303AGR adapter board for a standard DIL 24 socket

Solution Evaluation Tools

Part number	Status	Description	Type	Supplier
STEVAL-STLCS01V1	Active	SensorTile connectable sensor node: plug or solder	Sensor Solution Eval Boards	ST	STEVAL-STLCS01V1 Description: SensorTile connectable sensor node: plug or solder
STEVAL-STLCS02V1	Active	SensorTile connectable sensor node: solder only	Sensor Solution Eval Boards	ST	STEVAL-STLCS02V1 Description: SensorTile connectable sensor node: solder only

STM32 Open Development Environment

Part number	Status	Description	Type	Supplier
X-NUCLEO-IKS01A2	Active	Motion MEMS and environmental sensor expansion board for STM32 Nucleo	STM32 ODE Sense HW	ST	X-NUCLEO-IKS01A2 Description: Motion MEMS and environmental sensor expansion board for STM32 Nucleo

All resources

Expand all categories

	Resource title		Latest update

Product Specifications (1)

	Resource title		Latest update
PDF	DS10999 Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer 10.0		29 Nov 2018	29 Nov 2018 DS10999 Ultra-compact high-performance eCompass module: ultra-low-power 3D accelerometer and 3D magnetometer 10.0

Application Notes (1)

	Resource title		Latest update
PDF	AN4825 Ultra-compact high-performance eCompass module based on the LSM303AGR 1.0		22 Nov 2018	22 Nov 2018 AN4825 Ultra-compact high-performance eCompass module based on the LSM303AGR 1.0

Technical Notes & Articles (1)

	Resource title		Latest update
PDF	TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2		18 Jan 2021	18 Jan 2021 TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5 of 9)

	Resource title	Latest update
PDF	DT0105 1-point or 3-point tumble sensor calibration 1.1	21 Jan 2021	21 Jan 2021 DT0105 1-point or 3-point tumble sensor calibration 1.1
PDF	DT0076 Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation 1.0	28 Feb 2020	28 Feb 2020 DT0076 Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation 1.0
PDF	DT0103 Compensating for magnetometer installation error and hard-iron effects using accelerometer-assisted 2D calibration 1.0	30 Aug 2018	30 Aug 2018 DT0103 Compensating for magnetometer installation error and hard-iron effects using accelerometer-assisted 2D calibration 1.0
PDF	DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0	08 Jan 2021	08 Jan 2021 DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
PDF	DT0131 Digital magnetometer and e-Compass: efficient design tips 1.0	12 Dec 2018	12 Dec 2018 DT0131 Digital magnetometer and e-Compass: efficient design tips 1.0
PDF	DT0059 Ellipsoid or sphere fitting for sensor calibration 3.0	28 Feb 2020	28 Feb 2020 DT0059 Ellipsoid or sphere fitting for sensor calibration 3.0
PDF	DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0	11 Jan 2021	11 Jan 2021 DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
PDF	DT0104 Exploiting the magnetometer as a virtual gyroscope at low and ultra-high spin rates 1.0	30 Aug 2018	30 Aug 2018 DT0104 Exploiting the magnetometer as a virtual gyroscope at low and ultra-high spin rates 1.0
PDF	DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1	21 Jan 2021	21 Jan 2021 DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1

Application Notes for related Tools & Software (1)

	Resource title		Latest update
PDF	AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0		24 Mar 2021	24 Mar 2021 AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 2.0

Brochures (3)

	Resource title	Latest update
PDF	MEMS and Sensors Quick Reference Guide 2.0	07 Apr 2021	07 Apr 2021 MEMS and Sensors Quick Reference Guide 2.0
PDF	MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 2.1	06 Aug 2020	06 Aug 2020 MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 2.1
PDF	Sensor libraries software pack for STM32Cube 2.0	25 Feb 2021	25 Feb 2021 Sensor libraries software pack for STM32Cube 2.0

EDA Symbols, Footprints and 3D Models

Quality and Reliability

Part Number	Marketing Status	Package	RoHS Compliance Grade	Material Declaration**
LSM303AGR	Evaluation	LGA 2X2X1 12LD PITCH 0.5MM	Ecopack2	PDF XML
LSM303AGRTR	Active	LGA 2X2X1 12LD PITCH 0.5MM	Ecopack2	PDF XML

LSM303AGR

Package:

LGA 2X2X1 12LD PITCH 0.5MM

Material Declaration**:

PDF XML

More Info

LSM303AGRTR

Package:

LGA 2X2X1 12LD PITCH 0.5MM

Material Declaration**:

PDF XML

More Info

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number	Order from Distributors	Order from ST	Marketing Status	ECCN (US)	ECCN (EU)	Packing Type	Package	Temperature (°C)		Country of Origin	Budgetary Price (US$)*/Qty
Part Number	Order from Distributors	Order from ST	Marketing Status	ECCN (US)	ECCN (EU)	Packing Type	Package	min	max	Country of Origin	Budgetary Price (US$)*/Qty
LSM303AGRTR	No availability of distributors reported, please contact our sales office		Active	EAR99	NEC	Tape And Reel	LGA 2X2X1 12LD PITCH 0.5MM	-40	85	MALTA	1.485 / 1k
LSM303AGR	No availability of distributors reported, please contact our sales office		Evaluation	EAR99	NEC	Tray	LGA 2X2X1 12LD PITCH 0.5MM	-40	85	MALTA

LSM303AGRTR

Marketing Status

Active

ECCN (US)

EAR99

More Info

Budgetary Price (US$)*/Qty

1.485 / 1k

LSM303AGR

Marketing Status

Evaluation

ECCN (US)

EAR99

More Info

Budgetary Price (US$)*/Qty

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors