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The LSM303AGR is an ultra-low-power high-performance system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor.
The LSM303AGR has linear acceleration full scales of ±2g/±4g/±8g/±16g and a magnetic field dynamic range of ±50 gauss.
The LSM303AGR includes an I2C serial bus interface that supports standard, fast mode, fast mode plus, and high-speed (100 kHz, 400 kHz, 1 MHz, and 3.4 MHz) and an SPI serial standard interface.
The system can be configured to generate an interrupt signal for free-fall, motion detection and magnetic field detection.
The magnetic and accelerometer blocks can be enabled or put into power-down mode separately.
The LSM303AGR is available in a plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.Key Features
- 3 magnetic field channels and 3 acceleration channels
- ±50 gauss magnetic dynamic range
- ±2/±4/±8/±16 g selectable acceleration full scales
- 16-bit data output
- SPI / I2C serial interfaces
- Analog supply voltage 1.71 V to 3.6 V
- Selectable power mode/resolution for accelerometer and magnetometer
- Single measurement mode for magnetometer
- Programmable interrupt generators for free-fall, motion detection and magnetic field detection
- Embedded self-test
- Embedded temperature sensor
- Embedded FIFO
- ECOPACK®, RoHS and “Green” compliant
Sample & Buy
| Part Number | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| LSM303AGRTR | LGA 2X2X1 12LD PITCH 0.5MM | Tape And Reel |
Active
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1.485 | 1000 | EAR99 | - | Check Availability | Get sample |
| LSM303AGR | LGA 2X2X1 12LD PITCH 0.5MM | Tray |
Evaluation
|
- | - | EAR99 | - | No availability of distributors reported, please contact our sales office |
LSM303AGR
Package
LGA 2X2X1 12LD PITCH 0.5MMPacking Type
TrayUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
Ecosystems
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Picture Part number Manufacturer Description AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. Part NumberAWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture Part number Manufacturer Description LSM303AGR click MikroElektronika LSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer. Part NumberLSM303AGR click measures acceleration and magnetic field characteristics. It carries the LSM303AGR 3D accelerometer and 3D magnetometer.
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Picture Part number Manufacturer Description 
X-NUCLEO-IKS01A2 ST Motion MEMS and environmental sensor expansion board for STM32 Nucleo Part NumberMotion MEMS and environmental sensor expansion board for STM32 Nucleo
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Embedded Software
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Picture Part number Manufacturer Description 
X-CUBE-MEMS-XT1 ST Sensor and DSP algorithm software expansion for STM32Cube 
X-CUBE-MEMS1 ST Sensor and motion algorithm software expansion for STM32Cube Part NumberSensor and DSP algorithm software expansion for STM32Cube
Sensor and motion algorithm software expansion for STM32Cube
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Picture Part number Manufacturer Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) Part NumberAndroid sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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Evaluation Tools
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Picture Part number Manufacturer Description 
STEVAL-MKI172V1 ST LSM303AGR adapter board for a standard DIL 24 socket Part NumberLSM303AGR adapter board for a standard DIL 24 socket
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Picture Part number Manufacturer Description 
STEVAL-STLCS01V1 ST SensorTile connectable sensor node: plug or solder 
STEVAL-STLCS02V1 ST SensorTile connectable sensor node: solder only Part NumberSensorTile connectable sensor node: plug or solder
SensorTile connectable sensor node: solder only
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Support and Applications
| Part Number | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM303AGR |
Evaluation
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LGA 2X2X1 12LD PITCH 0.5MM | Ecopack2 |
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| LSM303AGRTR |
Active
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LGA 2X2X1 12LD PITCH 0.5MM | Ecopack2 |
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LSM303AGR
Package:
LGA 2X2X1 12LD PITCH 0.5MMMaterial Declaration**:
LSM303AGRTR
Package:
LGA 2X2X1 12LD PITCH 0.5MMMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
