Product overview
概要
The main objective of the ST67W611M1 reference designs, STDES-67W61BU-U5 (B and U versions, with STM32U5), STDES-67W61P1-U5 (P version, single antenna, with STM32U5), and STDES-67W61P2-U5 (P version with antenna diversity, with STM32U5), is to recommend layouts and associated BOMs for dedicated applications (these boards are not for sale).
The other objective is to show the good coexistence of the ST67W611M1 coprocessor module with the STM32U575AI host microcontroller in a small board form factor. Performance has been assessed and FCC and CE certification checks have been done by an independent test laboratory.
These reference designs can be manufactured from files available for download from the www.st.com website. The access to all GPIOs allows the prototyping of a complete application. Sensitive layout parts can be extracted and pasted in any user board design with the same PCB characteristics and feature set.
Utilizing the reference designs for user applications helps achieve suitable RF performance and aids in passing certification.
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All features
- Includes ST state-of-the-art patented technology
- Reference designs
- Fully open hardware platforms
- Based on the ST67W611M1 network coprocessor module
- Suitable for rapid prototyping of end nodes using Wi‑Fi 6 and Bluetooth® LE protocols with the STM32U575AI host microcontroller
- ST67W611M1A6B/U/P coprocessor module
- PCB antenna or MHF4 connector:
- ST67W611M1A6B module with PCB antenna in a 32‑pin, 4‑side LGA 1.27 mm pitch (17.28 × 12.28 × 2.37 mm) package
- ST67W611M1A6U module with MHF4 connector in a 32‑pin, 4‑side LGA 1.27 mm pitch (12.28 × 12.28 × 2.37 mm) package
- ST67W611M1A6P module with MHF4 connector in a 32‑pin, 4‑side LGA 1.27 mm pitch (12.28 × 12.28 × 2.37 mm) package
- 1 × 1 2.4 GHz Wi‑Fi 6/Bluetooth® LE combo all-in-one SoC
- Wi‑Fi 6, coprocessor IEEE 802.11 b/g/n/ax
- Single-band 2.4 GHz
- Low-power Wi‑Fi® with various sleep modes
- PCB antenna or MHF4 connector:
- STM32U575AII6Q host microcontroller
- Ultra-low-power Arm® Cortex®‑M33 32-bit MCU with Arm® TrustZone® and FPU
- 240 DMIPS, 2 Mbytes of flash memory, 786 Kbytes of SRAM
- BGA169 (7 × 7 mm) package
- Dedicated pinout supporting SMPS step-down converter
すべてのリソース
| Resource title | Version | Latest update | Actions | Details | ダウンロード |
|---|
Board Manufacturing Specifications (4)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |||
| ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |||
| ZIP | 1.0 | 27 May 2025 | 27 May 2025 | |||
| ZIP | 1.0 | 27 May 2025 | 27 May 2025 |
BOM (2)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |||
| ZIP | 1.0 | 27 May 2025 | 27 May 2025 |
Schematic Pack (2)
| Resource title | Version | Latest update | Actions | Options | ||
|---|---|---|---|---|---|---|
| ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |||
| ZIP | 1.0 | 16 Jun 2025 | 16 Jun 2025 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHSコンプライアンスグレード | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|---|---|---|
| STDES-67W61BU-U5 | Active 交換品交換品 | - | Industrial | - | - | - | - | |
STDES-67W61BU-U5
Package:
-Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
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Sample & Buy
| Part Number | 製品ステータス | Budgetary Price (US$)*/Qty | STから購入 | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STDES-67W61BU-U5 | | | distributors 販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください |
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STDES-67W61BU-U5 Active
販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
（*）概算用の参考価格（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。