Product overview
Description
The main objective of the ST67W611M1 reference design, STDES-67W61BU-U5, is to recommend a layout and associated BOM for dedicated applications (this board is not for sale).
The other objective is to show the good coexistence of the ST67W611M1 coprocessor module with the STM32U575AI host microcontroller in a small board form factor. Performance has been assessed and FCC and CE certification checks have been done by an independent test laboratory.
This reference design can be manufactured from files available for download from the www.st.com website. The access to all GPIOs allows the prototyping of a complete application. Sensitive layout parts can be extracted and pasted in any user board design with the same PCB characteristics and feature set.
Utilizing the reference design for user applications helps achieve suitable RF performance and aids in passing certification.
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All features
- Includes ST state-of-the-art patented technology
- Reference design
- Fully open hardware platform
- Based on the ST67W611M1 network coprocessor module
- Suitable for rapid prototyping of end nodes using Wi‑Fi 6, Bluetooth® LE, and 802.15.4 protocols with the STM32U575AI host microcontroller
- ST67W611M1A6B/U coprocessor module
- PCB or MHF4 antenna:
- ST67W611M1A6B module with PCB antenna in a 32‑pin, 4‑side LGA 1.27 mm pitch (17.28 × 12.28 × 2.37 mm) package
- ST67W611M1A6U module with MHF4 antenna in a 32‑pin, 4‑side LGA 1.27 mm pitch (12.28 × 12.28 × 2.37 mm) package
- 1 × 1 2.4 GHz Wi‑Fi 6/Bluetooth® LE/802.15.4 combo all-in-one SoC
- Wi‑Fi 6, coprocessor IEEE 802.11 b/g/n/ax
- Single-band 2.4 GHz
- Low-power Wi‑Fi® with various sleep modes
- PCB or MHF4 antenna:
- STM32U575AII6Q host microcontroller
- Ultra-low-power Arm® Cortex®‑M33 32-bit MCU with Arm® TrustZone® and FPU
- 240 DMIPS, 2 Mbytes of flash memory, 786 Kbytes of SRAM
- BGA169 (7 × 7 mm) package
- Dedicated pinout supporting SMPS step-down converter
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All resources
Resource title | Version | Latest update |
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Board Manufacturing Specifications (4)
Resource title | Version | Latest update | ||
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ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |
ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |
ZIP | 1.0 | 27 May 2025 | 27 May 2025 | |
ZIP | 1.0 | 27 May 2025 | 27 May 2025 |
Bill of Materials (2)
Resource title | Version | Latest update | ||
---|---|---|---|---|
ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |
ZIP | 1.0 | 27 May 2025 | 27 May 2025 |
Schematic Pack (2)
Resource title | Version | Latest update | ||
---|---|---|---|---|
ZIP | 1.0 | 26 May 2025 | 26 May 2025 | |
ZIP | 1.0 | 27 May 2025 | 27 May 2025 |
Quality and Reliability
Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | WEEE Compliant | Longevity Commitment | Longevity Starting Date | Material Declaration** |
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STDES-67W61BU-U5 | Active | - | Industrial | - | - | - | - | |
STDES-67W61BU-U5
Package:
-Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Core Product | |
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STDES-67W61BU-U5 | | | distributors No availability of distributors reported, please contact our sales office |
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STDES-67W61BU-U5 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors