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LSM6DSO32

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iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

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The LSM6DSO32 is a system-in-package featuring a 3D digital accelerometer and 3D digital gyroscope boosting power performance to 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DSO32 supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO32 has a full-scale acceleration range of ±4/±8/±16±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32 is available in a plastic land grid array (LGA) package.

特徴
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbytes
- ±4/±8/±16/±32 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3C^SM serial interface with main processor data synchronization
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine: accelerometer, gyroscope and external sensors
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
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All tools & software

ソフトウェア開発ツール

製品型番	ステータス	概要	タイプ	サプライヤ
Unicleo-GUI	量産中	GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube	Sensor Software Development Tools	ST	Unicleo-GUI 概要: GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube
Unico-GUI	量産中	Linux / Mac OS X / Windows用MEMSセンサ評価キット･ソフトウェア･パッケージ	Sensor Software Development Tools	ST	Unico-GUI 概要: Linux / Mac OS X / Windows用MEMSセンサ評価キット･ソフトウェア･パッケージ

クラウド

製品型番	ステータス	概要	タイプ	サプライヤ
AZURE Cloud	量産中	Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.	クラウド	Microsoft	AZURE Cloud 概要: Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
Watson IoT Platform	量産中	IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.	クラウド	IBM	Watson IoT Platform 概要: IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

コンポーネント & モジュール

製品型番	ステータス	概要	タイプ	サプライヤ
IMU383ZA	量産中	High-performance inertial platform.	コンポーネント & モジュール	ACEINNA	IMU383ZA 概要: High-performance inertial platform.
SensiBLE	量産中	Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!	コンポーネント & モジュール	SensiEDGE	SensiBLE 概要: Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
SensiSUB	量産中	Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.	コンポーネント & モジュール	SensiEDGE	SensiSUB 概要: Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

MCU & MPU組込みソフトウェア

製品型番	ステータス	概要	タイプ	サプライヤ
X-CUBE-MEMS1	量産中	Sensor and motion algorithm software expansion for STM32Cube	STM32Cube拡張パッケージ	ST	X-CUBE-MEMS1 概要: Sensor and motion algorithm software expansion for STM32Cube

MEMS and Sensors Software

製品型番	ステータス	概要	タイプ	サプライヤ
C-Driver-MEMS	量産中	Standard C platform-independent drivers for MEMS motion and environmental sensors	MEMS用ドライバ	ST	C-Driver-MEMS 概要: Standard C platform-independent drivers for MEMS motion and environmental sensors
FSM-Examples	量産中	Configuration examples for embedded Finite State Machine feature	MEMS用ドライバ	ST	FSM-Examples 概要: Configuration examples for embedded Finite State Machine feature

Product Evaluation Tools

製品型番	ステータス	概要	タイプ	サプライヤ
STEVAL-MKI109V3	量産中	プロフェッショナルMEMSボード: STM32F401VEマイコンをベースに、STのあらゆるMEMSアダプタに対応するMEMSマザーボード	MEMSモーションセンサ用評価ボード	ST	STEVAL-MKI109V3 概要: プロフェッショナルMEMSボード: STM32F401VEマイコンをベースに、STのあらゆるMEMSアダプタに対応するMEMSマザーボード
STEVAL-MKI215V1	量産中	LSM6DSO32 adapter board for a standard DIL24 socket	MEMSモーションセンサ用評価ボード	ST	STEVAL-MKI215V1 概要: LSM6DSO32 adapter board for a standard DIL24 socket

エンジニアリング･サービス

製品型番	ステータス	概要	タイプ	サプライヤ
SensiEDGE customization services	量産中	End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!	エンジニアリング･サービス	SensiEDGE	SensiEDGE customization services 概要: End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
SensorTile.box customization services	量産中	Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.	エンジニアリング･サービス	FAE Technology	SensorTile.box customization services 概要: Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

All resources

製品スペック (1)

	Resource title		Latest update
PDF	DS12941 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 1.1		16 Mar 2020	16 Mar 2020 DS12941 iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope 1.1

アプリケーションノート (2)

	Resource title		Latest update
PDF	AN5505 LSM6DSO32: Finite State Machine 1.0		01 Jun 2020	01 Jun 2020 AN5505 LSM6DSO32: Finite State Machine 1.0
PDF	AN5473 LSM6DSO32: always-on 3D accelerometer and 3D gyroscope 1.0		15 Jun 2020	15 Jun 2020 AN5473 LSM6DSO32: always-on 3D accelerometer and 3D gyroscope 1.0

技術ノート & 解説 (1)

	Resource title		Latest update
PDF	TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2		18 Jan 2021	18 Jan 2021 TN0018 Surface mounting guidelines for MEMS sensors in an LGA package 6.2

Design Notes & Tips (5)

	Resource title	Latest update
PDF	DT0105 1-point or 3-point tumble sensor calibration 1.1	21 Jan 2021	21 Jan 2021 DT0105 1-point or 3-point tumble sensor calibration 1.1
PDF	DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0	08 Jan 2021	08 Jan 2021 DT0058 Computing tilt measurement and tilt-compensated eCompass 3.0
PDF	DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0	11 Jan 2021	11 Jan 2021 DT0060 Exploiting the gyroscope to update tilt measurement and eCompass 3.0
PDF	DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0	22 Apr 2020	22 Apr 2020 DT0064 Noise analysis and identification in MEMS sensors, Allan, Time, Hadamard, Overlapping, Modified, Total variance 1.0
PDF	DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1	21 Jan 2021	21 Jan 2021 DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning 1.1

ツール&ソフトウェア用アプリケーション・ノート (1)

	Resource title		Latest update
PDF	AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 1.0		18 Jun 2019	18 Jun 2019 AN5353 How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications 1.0

プレゼンテーション (1)

	Resource title		Latest update
PDF	iNEMO* inertial modules: Evaluation tools and GUI 1.0		13 Jan 2021	13 Jan 2021 iNEMO* inertial modules: Evaluation tools and GUI 1.0

フライヤ (3)

	Resource title	Latest update
PDF	ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0	11 Mar 2020	11 Mar 2020 ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
PDF	LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.1	01 Jul 2020	01 Jul 2020 LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.1
PDF	LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0	11 Mar 2020	11 Mar 2020 LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0

パンフレット (4)

	Resource title	Latest update
PDF	MEMS Sensors for automotive applications 1.0	13 Jun 2019	13 Jun 2019 MEMS Sensors for automotive applications 1.0
PDF	MEMS and Sensors Quick Reference Guide 1.1	09 Dec 2020	09 Dec 2020 MEMS and Sensors Quick Reference Guide 1.1
PDF	MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1	06 Aug 2020	06 Aug 2020 MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.1
PDF	Sensor & motion algorithm software pack for STM32Cube 1.0	29 Oct 2018	29 Oct 2018 Sensor & motion algorithm software pack for STM32Cube 1.0

EDA Symbols, Footprints and 3D Models

品質 & 信頼性

製品型番	Marketing Status	パッケージ	RoHSコンプライアンスグレード	材料宣誓書**
LSM6DSO32TR	量産中	VFLGA2.5X3X.86 14L P.5 L.475X.25	Ecopack2

LSM6DSO32TR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

More Info

Marketing Status

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

	製品型番	販売代理店からオーダー	STからオーダー	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	温度（℃）		Country of Origin	Budgetary Price (US$)*/Qty
	製品型番	販売代理店からオーダー	STからオーダー	製品ステータス	ECCN (US)	ECCN (EU)	梱包タイプ	パッケージ	最小	最大	Country of Origin	Budgetary Price (US$)*/Qty
	LSM6DSO32TR	販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください		量産中	EAR99	NEC	Tape And Reel	VFLGA2.5X3X.86 14L P.5 L.475X.25	-40	85	PHILIPPINES	1.75 / 1k

LSM6DSO32TR

製品ステータス

量産中

ECCN (US)

EAR99

詳細情報

Budgetary Price (US$)*/Qty

1.75 / 1k

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

VFLGA2.5X3X.86 14L P.5 L.475X.25

Operating Temperature (°C)

(最小)

-40

(最大)

Budgetary Price (US$)* / Qty

1.75 / 1k

Country of Origin

PHILIPPINES

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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LSM6DSO32

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推奨コンテンツ

All tools & software

ソフトウェア開発ツール

クラウド

コンポーネント & モジュール

MCU & MPU組込みソフトウェア

MEMS and Sensors Software

Product Evaluation Tools

エンジニアリング･サービス

All resources

製品スペック (1)

アプリケーションノート (2)

技術ノート & 解説 (1)

Design Notes & Tips (5)

ツール&ソフトウェア用アプリケーション・ノート (1)

プレゼンテーション (1)

フライヤ (3)

パンフレット (4)

EDA Symbols, Footprints and 3D Models

品質 & 信頼性

サンプル & 購入