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STGSB200M65DF2AG

量産中
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Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

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製品概要

概要

This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the M series IGBTs, which represent an optimal balance between inverter system performance and efficiency where the low-loss and the short-circuit functionality is essential. Furthermore, the positive VCE(sat) temperature coefficient and the tight parameter distribution result in safer paralleling operation. Thanks to the DBC substrate, the ACEPACK SMIT surface mounting power package offers a low thermal resistance coupled with a electrical isolated top side thermal pad.

  • 特徴

    • AEC-Q101 qualified
    • 6 μs of minimum short-circuit withstand time
    • VCE(sat) = 1.65 V (typ.) @ IC = 200 A
    • Tight parameter distribution
    • Positive VCE(sat) temperature coefficient
    • Low thermal resistance
    • Maximum junction temperature: TJ = 175 °C
    • Dice on direct bond copper (DBC) substrate
    • Isolation rating of 3400 Vrms/min
    • UL recognition: UL 1557 file E81734
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製品スペック (1)

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - STGSB200M65DF2AG

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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SPICE models (1)

Resource title
Latest update
STGSB200M65DF2AG SPICE model 1.0
29 Jan 2021
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品質 & 信頼性

製品型番 Marketing Status 概要 パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STGSB200M65DF2AG
量産中
Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package ACEPACK SMIT オートモーティブ Ecopack2

STGSB200M65DF2AG

Package:

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

Material Declaration**:

More Info

Marketing Status

量産中

General Description

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

Package

ACEPACK SMIT

Grade

Automotive

(**) st.comで提供している材料宣誓書は、パッケージ･ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

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製品ステータス
ECCN (US)
ECCN (EU)
梱包タイプ
パッケージ
温度（℃） Budgetary Price (US$)*/Qty
詳細情報
最小
最大
STGSB200M65DF2AG

販売代理店に在庫がない場合は、STのセールス･オフィスまでお問い合わせください
量産中
EAR99 NEC Tape And Reel ACEPACK SMIT -40 175 12.675 / 50
詳細情報

Country of Origin:

PHILIPPINES

概要:

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

STGSB200M65DF2AG

製品ステータス

量産中

ECCN (US)

EAR99
詳細情報

Budgetary Price (US$)*/Qty

12.675 / 50

ECCN (EU)

NEC

梱包タイプ

Tape And Reel

パッケージ

ACEPACK SMIT

Operating Temperature (°C)

(最小)

-40

(最大)

175

Budgetary Price (US$)* / Qty

12.675 / 50

Country of Origin

PHILIPPINES

概要

Automotive-grade trench gate field-stop, 650 V, 200 A low-loss M series IGBT in an ACEPACK SMIT package

（*）概算用の希望小売単価（US$）です。現地通貨でのお見積りについては、STのセールス･オフィスまたは販売代理店までお問い合わせください。

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