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  • The STSAFE-TPM (trusted platform module) family of products offers a broad portfolio of standardized solutions for embedded, PC, mobile and computing applications. STSAFE is an ST trademark.

    It includes turnkey products compliant with the Trusted Computing Group (TCG) standards that provide services to protect the confidentiality, integrity and authenticity of information and devices.
    These devices are easy to integrate thanks to the variety of supported interfaces and the availability of TPM ecosystem software solutions.
    The STSAFE-TPM devices are all Common Criteria (EAL4+) and FIPS certified.
    They embed an Arm® SecurCore SC300™ processor with additional security features to help protect against advanced forms of attack.
    The ST33TPHF2ESPI offers a slave serial peripheral interface (SPI) compliant with the TCG PC Client TPM Profile specifications.
    The ST33TPHF2ESPI supports two exclusive modes that support either TPM 1.2 or TPM 2.0 commands. The product can be locked irreversibly in TPM 1.2 or TPM 2.0 mode during provisioning, or only after provisioning to provide a smooth migration between TPM 1.2 and TPM 2.0.
    The ST33TPHF2ESPI operates in the –25 to +85 °C commercial temperature range with a supply and I/O voltage of 1.8 V, or in the –40 °C to 105 °C extended temperature range with a supply and I/O voltage of 3.3 V.
    The device is offered in TSSOP28 and VFQFPN32 ECOPACK2 packages. ECOPACK is an ST trademark.

    主な特徴

    • TPM features
      • Flash-memory-based Trusted Platform Module (TPM)
      • Supporting two modes exclusively with either the TPM 1.2 or the TPM 2.0 command set
      • Supporting dynamic switch from one mode to another and capability to lock one mode irreversibly
      • For TPM 1.2, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Main specifications 1.2, Level 2, Revision 116 and TCG PC Client Specific TPM Interface Specifications 1.3
      • For TPM 2.0, compliant with Trusted Computing Group (TCG) Trusted Platform Module (TPM) Library specifications 2.0, Level 0, Revision 138 and TCG PC Client Specific TPM Platform Specifications 1.03
      • TPM firmware code can be upgraded thanks to a persistent Flash-memory loader application to support new standard evolutions
      • Common Criteria (CC) certification according to the TPM 1.2 and TPM 2.0 protection profiles at EAL4+
      • FIPS 140-2 level 1 certification for both modes and level 2 for mode TPM2.0
      • SPI support for up to 33 MHz in FIFO and CRB protocol modes
      • Support for software and hardware physical presence for TPM 1.2 and TPM 2.0
    • Hardware features
      • Arm® SecurCore® SC300™ 32-bit RISC core
      • Highly reliable Flash memory technology
      • Extended temperature range: −40 °C to 105 °C
      • ESD (electrostatic discharge) protection up to 4 kV (HBM)
      • 1.8 V or 3.3 V supply voltage range
      • 28-lead thin shrink small outline and 32-lead very thin fine pitch quad flat pack ECOPACK packages
    • Security features
      • Active shield and environmental sensors
      • Memory protection unit (MPU) used to segregate TPM assets between TPM 1.2 and TPM 2.0 modes
      • Monitoring of environmental parameters (power)
      • Hardware and software protection against fault injection
      • FIPS compliant RNG built on an SP800-90A compliant SHA256 DRBG and an AIS-31 Class PTG2 compliant true random number generator (TRNG)
      • Cryptographic algorithms:
        • RSA key generation (1024 or 2048 bits)
        • RSA signature and encryption
        • HMAC SHA-1 & SHA-256
        • AES-128-192-256
        • ECC 224 & 256 bits
    • Product compliance
      • TPM 1.2 compliant with Microsoft® Windows® 7, 8.1 and 10
      • TPM 2.0 compliant with Microsoft Windows 10
      • Compliant with Intel® TXT for TPM1.2 and TPM 2.0 in SPI FIFO mode
      • TPM 1.2 and TPM 2.0 compliant with the respective TCG test suites

推奨コンテンツ

評価ツール

    • 製品型番

      TPM development kit

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 バージョン サイズ アクション
      DB2716
      Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface
      4.0
      434.22 KB
      PDF
      DB2716

      Flash-memory-based device combining TPM 1.2 and TPM 2.0 with an SPI interface

    • 概要 バージョン サイズ アクション
      TN1330
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates
      1.0
      158.71 KB
      PDF
      TN1309
      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations
      2.0
      185.23 KB
      PDF
      TN1330

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

      TN1309

      ST33TPHF2ESPI, ST33TPHF20SPI, ST33TPHF2EI2C and ST33TPHF20I2C TPM 2.0 security recommendations

関連資料

    • 概要 バージョン サイズ アクション
      STSAFE-TPM Standardized solution for trusted devices 1.0
      226.91 KB
      PDF

      STSAFE-TPM Standardized solution for trusted devices

    • 概要 バージョン サイズ アクション
      Make LoRa® easy and secure 1.0
      1.16 MB
      PDF
      Making Sigfox devices easy and secure 1.0
      1.1 MB
      PDF
      STSAFE - Secure Solutions for IoT 1.0
      1.13 MB
      PDF

      Make LoRa® easy and secure

      Making Sigfox devices easy and secure

      STSAFE - Secure Solutions for IoT

Digital Certificates

    • 概要 バージョン サイズ アクション
      GlobalSign Trusted Computing CA 1.0
      928 Byte(s)
      ZIP
      GlobalSign Trusted Platform Module ECC Root CA 1.0
      693 Byte(s)
      ZIP
      ST Intermediate CA 05 1.0
      1.04 KB
      ZIP
      ST TPM Root Certificates 1.0
      1.07 KB
      ZIP
      ST Trusted Platform Module (TPM) endorsement key (EK) certificates 4.0
      185.14 KB
      PDF
      STM TPM ECC Intermediate CA 01 1.0
      691 Byte(s)
      ZIP
      STM TPM ECC Root CA 01 1.0
      800 Byte(s)
      ZIP

      GlobalSign Trusted Computing CA

      GlobalSign Trusted Platform Module ECC Root CA

      ST Intermediate CA 05

      ST TPM Root Certificates

      ST Trusted Platform Module (TPM) endorsement key (EK) certificates

      STM TPM ECC Intermediate CA 01

      STM TPM ECC Root CA 01

品質 & 信頼性

製品型番 製品ステータス パッケージ RoHSコンプライアンスグレード 材料宣誓書**
ST33HTPH2E28AHD0
量産中
TSSOP28 9.7 x 4.4 Ecopack2
ST33HTPH2E32AHD0
量産中
VFQFPN 32 5x5x1.0 Ecopack2

ST33HTPH2E28AHD0

Package:

TSSOP28 9.7 x 4.4

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

TSSOP28 9.7 x 4.4

RoHS Compliance Grade

Ecopack2

ST33HTPH2E32AHD0

Package:

VFQFPN 32 5x5x1.0

Material Declaration**:

PDF XML

Marketing Status

量産中

Package

VFQFPN 32 5x5x1.0

RoHS Compliance Grade

Ecopack2

(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください

サンプル & 購入

製品型番
販売代理店からオーダー
STからオーダー
製品ステータス
パッケージ
梱包タイプ
ECCN (EU)
Country of Origin
Budgetary Price (US$)*/Qty
ST33HTPH2E32AHD0

販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください

量産中
VFQFPN 32 5x5x1.0 Tape And Reel NEC PHILIPPINES
ST33HTPH2E28AHD0

販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください

量産中
TSSOP28 9.7 x 4.4 Tape And Reel NEC PHILIPPINES

ST33HTPH2E32AHD0

製品ステータス

量産中

単価(US$)

-

Budgetary Price (US$)*/Qty

パッケージ

VFQFPN 32 5x5x1.0

梱包タイプ

Tape And Reel

ECCN (EU)

NEC

Country of Origin

PHILIPPINES

ST33HTPH2E28AHD0

製品ステータス

量産中

単価(US$)

-

Budgetary Price (US$)*/Qty

パッケージ

TSSOP28 9.7 x 4.4

梱包タイプ

Tape And Reel

ECCN (EU)

NEC

Country of Origin

PHILIPPINES

(*)概算用の希望小売単価(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。